SAKI smt 3D SPI machine 3Si-MS2

I-SAKI 3Si-MS2 sisizukulwana esitsha se-3D yenkqubo yokuhlola i-solder paste (SPI) esungulwe ngu-SAKI. Yamkela iteknoloji yokulinganisa i-multi-spectral kwaye yenzelwe ukulawula umgangatho wenkqubo yokushicilela i-solder paste kwimveliso ye-elektroniki echanekileyo. Inkqubo inokuqonda ngokukhawuleza kunye nokuhlolwa okuchanekileyo kwe-three-dimensional morphology ye-solder paste kwimigca yemveliso ye-SMT, ukukhusela ngokufanelekileyo iziphene ze-welding.

2. Iinkcukacha zobugcisa ezingundoqo

Iiparamitha ezineenkcukacha zeProjekthi

Itekhnoloji yokubona i-Multi-spectral imaging ye-3D + i-laser triangulation

Ukuchaneka koMlinganiso umgca ongu-Z ±0.5μm, umgca we-XY ±3μm

Isantya somlinganiselo Ubuninzi 1200mm/s

Ubude bokulinganisa ububanzi 0-500μm

Ubuncinci becandelo lokubona 008004 (0201) icandelo

Ubungakanani bePCB inkxaso Ubuninzi 510×510mm (customizable)

Inkqubo yomthombo wokukhanya Multi-wavelength LED indibaniselwano (UV/ukukhanya okubonakalayo/IR)

Phinda ukuchaneka ≤±0.3μm

I-data interface SECS/GEM, OPC UA, TCP/IP

3. Iimpawu ezibalaseleyo

3.1 Iteknoloji ye-multi-spectral fusion

I-UV + ukukhanya okubonakalayo + inkqubo yomfanekiso wamaqela amathathu e-infrared

Iyakwazi ngaxeshanye ukubona i-solder paste ubude, indawo, umthamo kunye nokumila

Ukuchonga ngokufanelekileyo iziphene ezikhethekileyo ezifana ne-solder paste oxidation kunye nokungcoliswa

3.2 Inkqubo yokubona ngobukrelekrele

Uhlalutyo oluncediswa yi-AI: ukufunda ngokuzenzekelayo kwiiparamitha zenkqubo

Imbuyekezo eDynamic: ulungiso lwexesha lokwenyani lweziphumo ze-PCB warping

Umlinganiselo obonakalayo: qikelela iziphumo zokuphinda zifakwe kwi-solder

3.3 Uyilo lwemveliso olusebenzayo

Ukusetyenzwa kweendlela ezimbini ezinxuseneyo: imveliso inyuke nge-40%

Ukuchongwa kwephaneli ekrelekrele: ukusetyenzwa ngokuzenzekelayo kweepaneli ezingaqhelekanga

Ukutshintsha komgca okhawulezayo: ukutshintshwa kweprogram <15 imizuzwana

4. Imisebenzi engundoqo

4.1 Umsebenzi wokufumanisa i-3D

Umlinganiselo wokuhanjiswa kobungqingqwa be-Solder

Ubalo lwevolumu (ijoyinti enye yesoda/iphelele)

Uhlalutyo lwemilo yecontour

Ukuvala uqikelelo lomngcipheko

4.2 Ukufumanisa i-2D encedisayo

I-Solder Cola indawo yokucima

Isazisi sokuvaleka komnatha wentsimbi

Ukubhaqwa kongcoliseko lwe-solder

Uhlalutyo lwengcebiso yokutsalwa koshicilelo

4.3 Uhlalutyo lwedatha

Ulawulo lwenkqubo yeSPC yexesha langempela

Uhlalutyo lwengcambu ye-NG

Uqikelelo lwenkqubo

Yenza iingxelo zovavanyo ngokuzenzekelayo

5. Imiqathango yokusetyenziswa

5.1 Iimfuno zokusingqongileyo

Iqondo lobushushu: 23±2℃ (yeyona ndawo yobushushu obuqhubekayo)

Ukufuma: 45-65%RH

Ucoceko: Igumbi elicocekileyo le-10000 liyacetyiswa

Ukungcangcazela: <0.1G (iqonga lokulwa nokungcangcazela liyafuneka)

5.2 Iinkcukacha zokusebenza

Inkqubo yokuvula amandla:

Inkqubo yokufudumeza imizuzu engama-20

Yenza ulungelelwaniso oluzenzekelayo (Ulungelelwaniso oluzenzekelayo)

Qinisekisa ixabiso lomlinganiselo wepleyiti eqhelekileyo

Ukusebenza kwemihla ngemihla:

Coca ifestile yamehlo rhoqo kwiiyure ezi-2

Gcina inkqubo yobhaqo rhoqo

Beka esweni ubume bobushushu benkqubo

Izilumkiso zokhuseleko:

Musa ukuvala imingxunya yokuchitha ubushushu

Musa ukusebenzisa ii-arhente zokucoca ezingezizo ezoqobo

Inqanaba lokhuseleko lweLaser Udidi 2

6. Ukusombulula ingxaki eqhelekileyo

Ikhowudi yempazamo yenkcazo yePhenomenon Isisombululo

E2011 Isivamvo esingaqhelekanga se-Spectral 1. Qala kwakhona imodyuli ye-spectral

2. Jonga intambo yoqhagamshelwano

E2105 Z-impazamo yokumisa i-axis 1. Coca inzwa yobude

2. Hlaziya umgca we-Z

E2203 Ubushushu bodlula umda 1. Jonga inkqubo yokupholisa

2. Misa ukupholisa

E2308 Ugcino lwedatha aluphumelelanga 1. Jonga imo yehard disk

2. Yandisa indawo yokugcina

E2402 Uphazamiseko lonxibelelwano 1. Qala ngokutsha inkonzo yenethiwekhi

2. Jonga uqhagamshelo lokutshintsha

7. Indlela yokugcina

7.1 Ulondolozo lwemihla ngemihla

Ishifti nganye:

Coca ifestile yamehlo (sebenzisa ilaphu elingenathuli + isopropyl alcohol)

Jonga ukutsalwa kwebhanti lokuhambisa

Qinisekisa uxinzelelo lomthombo womoya (ukuba ukhona)

Rhoqo ngeveki:

Yenza ulungelelwaniso olubanzi lwamehlo

Gcina imilinganiselo yenkqubo

Coca isihluzo sokucoca ubushushu

7.2 Ukugcinwa rhoqo

Ngenyanga:

Thatha indawo yemithombo yokukhanya ye-LED eyalupheleyo

Lubricate izikhokelo zomgca

Jonga ukunxiba kwentambo

Ngekota:

Lungiselela nzulu inkqubo yomlinganiselo

Khangela ukuxhathisa komhlaba

Hlaziya inkqubo ye-firmware

7.3 Ulondolozo lonyaka

Kwenziwe ziinjineli zasefektri yokuqala:

Ulungelelwaniso olupheleleyo lwenkqubo ye-spectral

Ukuchongwa kokuchaneka kobume bomatshini

Lawula inkqubo yokusebenza kakuhle

8. Iinzuzo zobugcisa

Ukuchaneka okuphezulu kakhulu: amandla okulinganisa i-sub-micron

Ukubonwa kwe-Multi-spectral: Uvavanyo olubanzi lwesimo se-solder paste

Uqikelelo olukrelekrele: Iingcebiso zenkqubo ye-AI

Isebenza kakuhle kwaye izinzile: uyilo oluzinzileyo lweshishini

Ukudityaniswa kwedatha: Ukudityaniswa okunzulu kunye ne-MES/ERP

9. Iingcebiso zesicelo

Ii-elektroniki ezichanekileyo: Kucetyiswa ukuba usete isisombululo sokulinganisa kwi-5μm

I-Automotive electronics: Yenza imowudi yobhaqo engqongqo

Iibhodi ze-high-frequency: Ukwandisa iindawo zokubona isampuli

Ubume bemveliso yobuninzi: Kuyacetyiswa ukuba ulungelelanise kwaye uqinisekise rhoqo kwiiyure ezi-4