SAKI 3Si-LS2 smt 3D SPI machine

SAKI 3Si-LS2 is an advanced 3D solder paste inspection equipment (SPI) that uses laser triangulation technology and is designed for high-precision solder paste printing process quality control. The equipment can quickly and accurately detect the thickness, area, volume and shape of solder paste before reflow soldering, effectively preventing SMT assembly defects.

2. Core technical specifications

Project parameters

Detection technology: laser triangulation + color imaging

Measurement accuracy: thickness ±1μm, position ±5μm

Scanning speed: up to 800mm/s

Measurement height range: 0-300μm

Minimum detection component: 01005 (0402)

PCB size support: up to 510×460mm

Laser wavelength: 650nm (red laser)

Repeat accuracy: ±0.5μm

Data interface: SECS/GEM, TCP/IP

3. Core advantages

3.1 Ultra-high precision detection

Adopting dual laser scanning system, the thickness measurement accuracy reaches ±1μm

Sub-micron Z-axis resolution, can detect tiny solder paste differences

3.2 Efficient production adaptation

800mm/s high-speed scanning, single board detection time can be controlled within 15 seconds

Intelligent panel recognition, automatic processing of continuous panel detection

3.3 Intelligent data analysis

3D+2D composite analysis, simultaneous thickness and shape parameter evaluation

SPC real-time monitoring, automatic warning of process abnormalities

4. Outstanding features

4.1 Multimodal detection system

Laser scanning: Accurately measure height data

Color imaging: Assist in identifying defects such as solder paste contamination and diffusion

Infrared temperature measurement: Monitor solder paste temperature stability

4.2 Intelligent algorithm

Adaptive threshold: Automatically adjust the detection standard

Virtual measurement: Predict the shape of solder joints after reflow soldering

NG root cause analysis: Automatically trace the cause of defects

4.3 Humanized design

Automatic height alignment system: Adapt to different board thicknesses

Dual-track design: Detection and upper and lower boards are carried out simultaneously

Remote diagnosis: Support manufacturer online technical support

5. Operation precautions

5.1 Environmental requirements

Temperature: 23±3℃

Humidity: 40-60%RH

Cleanliness: Class 10000 and below

Vibration: <0.2G

5.2 Daily operation

Preparation for power on:

Warm up for 15 minutes

Perform automatic calibration

Confirm that the laser power is stable

Test settings:

A standard test library must be established for new models

Regularly verify the effectiveness of the test procedures

Safety regulations:

Do not look directly into the laser beam

Do not open the safety door when the equipment is running

6. Common errors and handling

Error code Fault description Solution

E1101 Laser abnormality 1. Check the laser power supply

2. Contact the manufacturer for maintenance

E1203 Z-axis movement exceeds the limit 1. Check the PCB thickness setting

2. Calibrate the Z-axis sensor

E1305 Communication timeout 1. Check the network cable connection

2. Restart the communication module

E1402 Image acquisition failed 1. Clean the optical window

2. Check the camera connection

E1508 Data storage abnormality 1. Check the hard disk space

2. Restart the system

7. Maintenance method

7.1 Daily maintenance

Daily:

Clean the laser window (use special cleaning paper)

Check the cleanliness of the conveyor track

Confirm the air source pressure (if applicable)

Weekly:

Perform a comprehensive optical calibration

Back up system parameters

Check the cooling fan status

7.2 Regular maintenance

Monthly:

Replace the filter cotton

Lubricate the linear guide

Check the cable connection

Quarterly:

Deeply calibrate the laser system

Replace the aging LED light source

Detect the system ground resistance

7.3 Annual maintenance

Performed by the original engineer:

Laser power calibration

Motion system accuracy detection

Control system firmware upgrade

8. Technical highlights

Dual laser scanning: Eliminate measurement shadows

Real-time 3D modeling: Intuitively display the solder paste status

Intelligent compensation algorithm: Automatically correct the impact of PCB warpage

Process traceability system: Comprehensively record the detection data

9. Application suggestions

High-density board: It is recommended to set the detection resolution to 10μm

Automotive electronics: Use strict detection standards

Flexible board: Use a special carrier to fix

Mass production environment: It is recommended to set the detection resolution to 10μm every 4 Sampling verification is performed once an hour

For detailed operation of this equipment, please refer to the SAKI 3Si-LS2 operation manual. It is recommended that operators complete SAKI certification training. Equipment maintenance requires the use of original factory-specified consumables. Unauthorized modifications may affect detection accuracy