SAKI 3Si-LS2 SMT 3D SPI makina

SAKI 3Si-LS2 ndi chipangizo chapamwamba cha 3D solder paste inspection equipment (SPI) chomwe chimagwiritsa ntchito ukadaulo wa laser triangulation ndipo chimapangidwa kuti chiziwongoleretsa kusindikiza kwapamwamba kwambiri. Zipangizozi zimatha kuzindikira mwachangu komanso molondola makulidwe, dera, voliyumu ndi mawonekedwe a solder phala musanayambe kutulutsanso, kuteteza bwino kuwonongeka kwa msonkhano wa SMT.

2. Zodziwika bwino zaukadaulo

Zosintha za polojekiti

Ukadaulo wozindikira: laser triangulation + kujambula kwamitundu

Kuyeza kulondola: makulidwe ± 1μm, malo ± 5μm

Kuthamanga kwa scan: mpaka 800mm / s

Kuyeza kutalika: 0-300μm

Chigawo chochepa cha kuzindikira: 01005 (0402)

PCB kukula thandizo: mpaka 510×460mm

Kutalika kwa laser: 650nm (laser wofiira)

Kubwereza kulondola: ± 0.5μm

Mawonekedwe a data: SECS/GEM, TCP/IP

3. Ubwino wapakati

3.1 Kuzindikira kolondola kwambiri

Kutengera wapawiri laser sikani dongosolo, makulidwe muyeso kulondola kufika ± 1μm

Sub-micron Z-axis resolution, imatha kuzindikira kusiyana kwakung'ono kwa solder

3.2 Kusintha koyenera kopanga

800mm / s kusanthula kothamanga kwambiri, nthawi yozindikira gulu limodzi imatha kuwongoleredwa mkati mwa masekondi 15

Kuzindikira gulu lanzeru, kukonza zodziwikiratu za kudziwika kosalekeza kwa gulu

3.3 Kusanthula deta mwanzeru

3D + 2D kusanthula kophatikizika, makulidwe nthawi imodzi ndi kuwunika kwa mawonekedwe

Kuyang'anira nthawi yeniyeni ya SPC, chenjezo lodziwikiratu la zovuta zadongosolo

4. Zapadera

4.1 Njira yodziwira Multimodal

Kusanthula kwa laser: kuyeza kutalika kwa data

Kujambula kwamitundu: Kuthandizira kuzindikira zolakwika monga kuipitsidwa ndi phala la solder ndi kufalikira

Muyezo wa kutentha kwa infrared: Yang'anirani kukhazikika kwa kutentha kwa solder

4.2 Algorithm yanzeru

Adaptive threshold: Sinthani zokha mulingo wozindikira

Muyeso wa Virtual: Loserani mawonekedwe a ma solder pambuyo pa kugulitsanso

Kusanthula kwazomwe zimayambitsa NG: Tsatirani zokha zomwe zimayambitsa zolakwika

4.3 Mapangidwe aumunthu

Dongosolo loyanjanitsa lokha patali: Sinthani ku makulidwe osiyanasiyana a board

Mapangidwe amtundu wapawiri: Kuzindikira ndi matabwa apamwamba ndi apansi kumachitika nthawi imodzi

Kuzindikira kwakutali: Thandizo laukadaulo la opanga pa intaneti

5. Njira zodzitetezera

5.1 Zofuna zachilengedwe

Kutentha: 23 ± 3 ℃

Chinyezi: 40-60% RH

Ukhondo: Kalasi 10000 ndi pansi

Kugwedezeka: <0.2G

5.2 Ntchito yatsiku ndi tsiku

Kukonzekera mphamvu pa:

Kutenthetsa kwa mphindi 15

Pangani calibration yokha

Tsimikizirani kuti mphamvu ya laser ndiyokhazikika

Zokonda zoyesa:

Laibulale yoyeserera iyenera kukhazikitsidwa yamitundu yatsopano

Nthawi zonse tsimikizirani mphamvu za njira zoyeserera

Malamulo achitetezo:

Osayang'ana mwachindunji mumtengo wa laser

Musatsegule chitseko chachitetezo pamene zida zikuyenda

6. Zolakwa wamba ndi kusamalira

Khodi yolakwika Kufotokozera molakwika Solution

E1101 Laser abnormality 1. Yang'anani mphamvu ya laser

2. Lumikizanani ndi wopanga kuti akonze

E1203 Z-axis kuyenda kumadutsa malire 1. Yang'anani mawonekedwe a PCB makulidwe

2. Sinthani sensa ya Z-axis

E1305 Kutha kwa kulumikizana 1. Yang'anani kulumikizidwa kwa chingwe cha netiweki

2. Yambitsaninso gawo loyankhulirana

E1402 Image kupeza analephera 1. Yeretsani kuwala zenera

2. Onani kulumikizana kwa kamera

E1508 Kuwonongeka kwa data 1. Yang'anani malo a hard disk

2. Yambitsaninso dongosolo

7. Njira yosamalira

7.1 Kusamalira tsiku ndi tsiku

Tsiku ndi Tsiku:

Yeretsani zenera la laser (gwiritsani ntchito mapepala apadera oyeretsera)

Yang'anani ukhondo wa njanji yonyamula katundu

Tsimikizirani kuthamanga kwa gwero la mpweya (ngati kuli kotheka)

Sabata iliyonse:

Chitani zonse zowunikira bwino

Bwezerani magawo adongosolo

Yang'anani momwe zimakupizira zimakupiza

7.2 Kusamalira nthawi zonse

Mwezi uliwonse:

Bwezerani thonje losefera

Mafuta a linear kalozera

Onani kugwirizana kwa chingwe

Kotala:

Sinthani mozama dongosolo la laser

Bwezerani gwero lowala la kuwala kwa LED

Kuzindikira dongosolo pansi kukana

7.3 Kusamalira pachaka

Zopangidwa ndi injiniya woyambirira:

Laser mphamvu calibration

Kuzindikira kulondola kwamayendedwe

Kusintha kwa firmware system

8. Zowunikira zaukadaulo

Kusanthula kwapawiri kwa laser: Chotsani mithunzi yoyezera

Real-time 3D modelling: Onetsani mwachidwi mawonekedwe a solder paste

Algorithm yanzeru yolipirira: Konzekerani zokha kukhudzidwa kwa tsamba la PCB

Njira yotsatirira njira: Lembani bwino zomwe zazindikirika

9. Malingaliro ogwiritsira ntchito

Gulu lapamwamba kwambiri: Ndikofunikira kuti muyike njira yodziwira kuti ikhale 10μm

Zamagetsi zamagalimoto: Gwiritsani ntchito mfundo zodziwika bwino

Flexible board: Gwiritsani ntchito chonyamulira chapadera kukonza

Malo opangira misa: Ndibwino kuti muyike njira yodziwikiratu kukhala 10μm iliyonse kutsimikizira kwa 4 Zitsanzo kumachitika kamodzi pa ola.

Kuti mudziwe zambiri za chipangizochi, chonde onani buku la SAKI 3Si-LS2. Ndikofunikira kuti ogwira ntchito amalize maphunziro a satifiketi ya SAKI. Kukonza zida kumafuna kugwiritsa ntchito zida zoyambilira zomwe zidafotokozedwa ndi fakitale. Kusintha kosaloledwa kungasokoneze kulondola kwa kuzindikira