Ekyuma kya SAKI 3Si-LS2 SMT 3D SPI

SAKI 3Si-LS2 ye kyuma eky’omulembe eky’okukebera solder paste (SPI) ekikozesa tekinologiya wa laser triangulation era nga kikoleddwa okulondoola omutindo gw’enkola y’okukuba solder paste mu ngeri entuufu. Ebyuma bino bisobola okuzuula amangu era mu butuufu obuwanvu, ekitundu, obuzito n’enkula y’ekikuta kya solder nga tebinnaba kuddamu kussa solder, ne kiziyiza bulungi obulema mu kukuŋŋaanya SMT.

2. Ebikulu ebikwata ku by’ekikugu

Ebipimo bya pulojekiti

Tekinologiya w’okuzuula: okukuba ebifaananyi mu ngeri ya layisi + okukuba ebifaananyi ebya langi

Obutuufu bw’okupima: obuwanvu ±1μm, ekifo ±5μm

Sipiidi y’okusika: okutuuka ku 800mm/s

Obugulumivu bw’okupima: 0-300μm

Ekitundu ekitono eky’okuzuula: 01005 (0402)

Obuwagizi bwa sayizi ya PCB: okutuuka ku 510×460mm

Obuwanvu bw’amayengo ga layisi: 650nm (layisi emmyufu)

Ddamu obutuufu: ±0.5μm

Enkolagana ya data: SECS/GEM, TCP/IP

3. Ebirungi ebikulu

3.1 Okuzuula mu butuufu obw’amaanyi ennyo

Nga twettanira enkola ya dual laser scanning system, obutuufu bw’okupima obuwanvu butuuka ku ±1μm

Sub-micron Z-axis resolution, esobola okuzuula enjawulo entonotono mu solder paste

3.2 Okukyusakyusa obulungi mu kukola ebintu

800mm/s high-speed scanning, single board okuzuula obudde busobola okufugibwa mu sikonda 15

Okutegeera panel mu ngeri ey’amagezi, okukola mu ngeri ey’otoma ey’okuzuula ekipande okutambula obutasalako

3.3 Okwekenenya ebikwata ku bantu mu ngeri ey’amagezi

3D+2D composite analysis, okwekenneenya obuwanvu n’enkula parameter mu kiseera kye kimu

SPC okulondoola mu kiseera ekituufu, okulabula okw’otoma ku nkola etali ya bulijjo

4. Ebintu eby’enjawulo

4.1 Enkola y’okuzuula mu ngeri ez’enjawulo

Laser scanning: Pima bulungi data y’obuwanvu

Okukuba ebifaananyi ebya langi: Okuyamba okuzuula obulema nga obucaafu bwa solder paste n’okusaasaana

Okupima ebbugumu mu infrared: Londoola okutebenkera kw’ebbugumu lya solder paste

4.2 Enkola ey’amagezi

Adaptive threshold: Okutereeza omutindo gw’okuzuula mu ngeri ey’otoma

Virtual measurement: Lagula enkula y’ebiyungo bya solder oluvannyuma lw’okuddamu okusoda

NG root cause analysis: Londoola mu ngeri ey’otoma ekivaako obulema

4.3 Enteekateeka y’omuntu

Enkola y’okulaga obugulumivu mu ngeri ey’otoma: Ekwatagana n’obuwanvu bw’embaawo ez’enjawulo

Dual-track design: Okuzuula n’embaawo eza waggulu n’eza wansi bikolebwa mu kiseera kye kimu

Okuzuula okuva ewala: Okuwagira omukozi ku yintaneeti obuyambi obw’ekikugu

5. Okwegendereza mu kukola emirimu

5.1 Ebyetaago by’obutonde bw’ensi

Ebbugumu: 23±3°C

Obunnyogovu: 40-60%RH

Obuyonjo: Class 10000 n’okudda wansi

Okukankana: <0.2G

5.2 Okukola buli lunaku

Okwetegekera amasannyalaze ku:

Bbuguma okumala eddakiika 15

Kola okupima okw’otoma

Kakasa nti amaanyi ga layisi gatebenkedde

Enteekateeka z’okugezesa:

Etterekero ly’okugezesa ery’omutindo lirina okuteekebwawo ku bikozesebwa ebipya

Bulijjo kakasa nti enkola z’okukebera zikola bulungi

Ebiragiro ebikwata ku byokwerinda:

Totunula butereevu mu kitangaala kya layisi

Toggulawo luggi lwa bukuumi ng’ebyuma bikola

6. Ensobi ezitera okubaawo n’engeri gye zikwatamu

Koodi y'ensobi Ennyonnyola y'ensobi Ekigonjoolwa

E1101 Laser abnormality 1. Kebera amasannyalaze ga layisi

2. Tuukirira abakola eddagala lino okuddaabiriza

E1203 Entambula ya Z-axis esukka ekkomo 1. Kebera ensengeka y’obuwanvu bwa PCB

2. Kaliba sensa ya Z-axis

E1305 Ekiseera ky’empuliziganya ekiwedde 1. Kebera omukutu gwa waya y’omukutu

2. Ddamu okutandika modulo y’empuliziganya

E1402 Okufuna ebifaananyi kulemereddwa 1. Yoza eddirisa ly’amaaso

2. Kebera okuyungibwa kwa kkamera

E1508 Obutabeera bulungi mu kutereka data 1. Kebera ekifo kya hard disk

2. Ddamu okutandika enkola

7. Enkola y’okuddaabiriza

7.1 Okuddaabiriza buli lunaku

Buli lunaku:

Okwoza eddirisa lya layisi (kozesa empapula ez’enjawulo ez’okwoza) .

Kebera obuyonjo bw’olutindo lw’okutambuza ebintu

Kakasa puleesa y’ensibuko y’empewo (bwe kiba kisoboka) .

Buli wiiki:

Kola okupima okujjuvu okw’amaaso

Back up enkola parameters

Kebera embeera ya cooling fan

7.2 Okuddaabiriza buli kiseera

Buli mwezi:

Kikyuseemu ppamba w’omusulo

Siiga ku kiwandiiko ekilungamya eky’ennyiriri

Kebera okuyungibwa kwa cable

Buli luvannyuma lwa myezi esatu:

Kaliba nnyo enkola ya layisi

Kikyuseemu ensibuko y’ettaala ya LED ekaddiye

Zuula enkola y’okuziyiza ettaka

7.3 Okuddaabiriza buli mwaka

Ekoleddwa yinginiya eyasooka:

Okupima amaanyi ga layisi

Okuzuula obutuufu bw’enkola y’entambula

Okufuga enkola ya firmware okulongoosa

8. Ebikulu mu by’ekikugu

Dual laser scanning: Ggyawo ebisiikirize by’okupima

Okukola 3D mu kiseera ekituufu: Laga mu ngeri ey’amagezi embeera ya solder paste

Intelligent compensation algorithm: Okutereeza mu ngeri ey’otoma enkosa ya PCB warpage

Enkola y’okulondoola enkola: Okuwandiika mu bujjuvu data y’okuzuula

9. Ebiteeso ku nkola y’okukozesa

High-density board: Kirungi okuteeka resolution y’okuzuula ku 10μm

Ebyuma ebikozesebwa mu mmotoka: Kozesa emitendera emikakali egy’okuzuula

Flexible board: Kozesa ekintu eky’enjawulo ekisitula okukitereeza

Embeera y’okufulumya ebintu mu bungi: Kirungi okuteeka okusalawo kw’okuzuula ku 10μm buli 4 Okukakasa okutwala sampuli kukolebwa omulundi gumu mu ssaawa

Okumanya ebikwata ku nkola y’ekyuma kino, laba ekitabo ekikwata ku nkola ya SAKI 3Si-LS2. Kirungi abaddukanya emirimu okumaliriza okutendekebwa mu kuweebwa satifikeeti ya SAKI. Okuddaabiriza ebyuma kyetaagisa okukozesa ebintu ebikozesebwa mu kkolero ebyasooka. Enkyukakyuka ezitakkirizibwa ziyinza okukosa obutuufu bw’okuzuula