SAKI 3Si-LS2 SMT 3D SPI umatshini

I-SAKI 3Si-LS2 sisixhobo sokuhlola i-solder ye-3D ephucukileyo (SPI) esebenzisa iteknoloji ye-laser triangulation kwaye yenzelwe ukuchaneka okuphezulu kwe-solder ukuncamathisela inkqubo yolawulo lomgangatho. Izixhobo ziyakwazi ukubona ngokukhawuleza nangokuchanekileyo ubukhulu, indawo, umthamo kunye nemilo ye-solder paste ngaphambi kokuba i-reflow soldering, ikhusele ngokufanelekileyo iziphene zendibano ye-SMT.

2. Iinkcukacha zobugcisa ezingundoqo

Iiparamitha zeprojekthi

Itekhnoloji yokufumanisa: i-laser triangulation + imaging yombala

Ukuchaneka komlinganiselo: ubukhulu ±1μm, indawo ± 5μm

Isantya sokuskena: ukuya kuthi ga kwi-800mm/s

Ubude bokulinganisa ububanzi: 0-300μm

Ubuncinane becandelo lokubona: 01005 (0402)

Ubungakanani benkxaso yePCB: ukuya kuthi ga kwi-510×460mm

Ubude beLaser: 650nm (i-laser ebomvu)

Phinda ukuchaneka: ± 0.5μm

Ujongano lwedatha: SECS/GEM, TCP/IP

3. Iinzuzo eziphambili

3.1 Ukuchongwa kokuchaneka okuphezulu kakhulu

Ukwamkela inkqubo ye-laser yokuskena kabini, ukuchaneka komlinganiselo wobunzima kufikelela ku-±1μm

Isisombululo se-Sub-micron Z-axis, sinokubona umahluko omncinci we-solder

3.2 Ukuziqhelanisa nemveliso esebenzayo

I-800mm / s ukuskena ngesantya esiphezulu, ixesha lokubona ibhodi enye linokulawulwa ngaphakathi kwemizuzwana eyi-15

Ukuqondwa kwephaneli ekrelekrele, ukusetyenzwa ngokuzenzekelayo kokubonwa kwephaneli eqhubekayo

3.3 Uhlalutyo lwedatha ekrelekrele

Uhlalutyo lwe-3D+2D oludityanisiweyo, ukutyeba ngaxeshanye kunye novavanyo lweparamitha yokumila

Ukujongwa kwexesha lokwenyani le-SPC, isilumkiso esizenzekelayo sokungahambi kakuhle kwenkqubo

4. Iimpawu ezibalaseleyo

4.1 Inkqubo yokufumanisa i-Multimodal

Ukuskena kweLaser: Ukulinganisa ngokuchanekileyo idatha yobude

Imifanekiso yombala: Ncedisa ekuchongeni iziphene ezifana nokungcoliswa kwe-solder paste kunye nokusabalalisa

Umlinganiselo wobushushu be-infrared: Lawula uzinzo lweqondo lobushushu kwi-solder

4.2 I-algorithm ekrelekrele

I-Adaptive threshold: Lungisa ngokuzenzekelayo umgangatho wokufumanisa

Umlinganiso obonakalayo: Qikelela imilo yamalungu e-solder emva kokuthengiswa kwakhona

Uhlalutyo lwengcambu ye-NG: Landela ngokuzenzekelayo unobangela weziphene

4.3 Uyilo lobuntu

Inkqubo yolungelelwaniso lobude obuzenzekelayo: Ziqhelanise nobukhulu bebhodi obahlukeneyo

Uyilo lweengoma ezimbini: Ukufunyanwa kunye neebhodi eziphezulu kunye nezisezantsi ziqhutyelwa ngaxeshanye

Ukuxilongwa okude: Inkxaso yomenzi wenkxaso ye-intanethi yenkxaso yobugcisa

5. Izilumkiso zokusebenza

5.1 Iimfuno zokusingqongileyo

Ubushushu: 23±3℃

Ukufuma: 40-60%RH

Ucoceko: Iklasi ye-10000 nangaphantsi

Ukungcangcazela: <0.2G

5.2 Ukusebenza kwemihla ngemihla

Ukulungiselela amandla kwi:

Ukufudumala imizuzu eyi-15

Yenza ulungelelwaniso oluzenzekelayo

Qinisekisa ukuba amandla e-laser azinzile

Iisetingi zovavanyo:

Makusekwe ilayibrari yovavanyo esemgangathweni yeemodeli ezintsha

Qinisekisa rhoqo ukusebenza kweenkqubo zovavanyo

Imigaqo yokhuseleko:

Musa ukujonga ngqo kwi-laser beam

Musa ukuvula umnyango wokhuseleko xa isixhobo sisebenza

6. Iimpazamo eziqhelekileyo kunye nokuphatha

Ikhowudi yemposiso Inkcazo yempazamo

E1101 Laser abnormality 1. Jonga unikezelo lwamandla ngelaser

2. Qhagamshelana nomvelisi ukuze ulondoloze

I-E1203 intshukumo ye-Z-axis igqithe kumda 1. Jonga isethingi yobukhulu bePCB

2. Lungiselela inzwa ye-Z-axis

E1305 Unxibelelwano luphelile 1. Jonga uqhagamshelwano lwentambo yenethiwekhi

2. Qala kwakhona imodyuli yonxibelelwano

E1402 Ukufumana umfanekiso akuphumelelanga 1. Coca ifestile yamehlo

2. Jonga uqhagamshelwano lwekhamera

E1508 Ukungaqheleki kokugcinwa kwedatha 1. Qwalasela isithuba sehard disk

2. Qala kwakhona inkqubo

7. Indlela yokugcina

7.1 Ulondolozo lwemihla ngemihla

Yonke imihla:

Coca ifestile yelaser (sebenzisa iphepha elikhethekileyo lokucoca)

Jonga ukucoceka kwendlela yokuhambisa

Qinisekisa uxinzelelo lomthombo womoya (ukuba ukhona)

Rhoqo ngeveki:

Yenza ulungelelwaniso olubanzi lwamehlo

Gcina imilinganiselo yenkqubo

Jonga imo yefeni yokupholisa

7.2 Ukugcinwa rhoqo

Ngenyanga:

Buyisela umqhaphu wokucoca

Thambisa isikhokelo somgca

Jonga uqhagamshelwano lwentambo

Ngekota:

Lungiselela ngokunzulu inkqubo yelaser

Faka endaweni yomthombo wokukhanya we-LED owalupheleyo

Khangela inkqubo yokuxhathisa umhlaba

7.3 Ulondolozo lonyaka

Kwenziwe yinjineli yokuqala:

Ukulinganisa amandla eLaser

Ukuchongwa kokuchaneka kwenkqubo yokunyakaza

Uphuculo lwe-firmware yenkqubo yokulawula

8. Amagqabantshintshi obugcisa

Ukuskena kabini kwelaser: Susa izithunzi zokulinganisa

Imodeli ye-3D yexesha langempela: bonisa ngokubonakalayo isimo se-solder paste

Intelligent imbuyekezo algorithm: Lungisa ngokuzenzekelayo impembelelo PCB warpage

Inkqubo yokulandela umkhondo: Rekhoda ngokupheleleyo idatha yobhaqo

9. Iingcebiso zesicelo

Ibhodi yoxinaniso oluphezulu: Kucetyiswa ukuba usete isisombululo sokubona kwi-10μm

Iimoto zombane: Sebenzisa imigangatho engqongqo yokubona

Ibhodi eguquguqukayo: Sebenzisa i-carrier ekhethekileyo ukulungisa

Ubume bemveliso yobuninzi: Kuyacetyiswa ukuseta isisombululo sokubhaqa ukuya kwi-10μm nganye i-4 yokuqinisekisa iSampuli yenziwa kanye ngeyure.

Ngomsebenzi oneenkcukacha wesi sixhobo, nceda ujonge kwincwadana yokusebenza ye-SAKI 3Si-LS2. Kuyacetyiswa ukuba abaqhubi bagqibe uqeqesho lwesatifikethi se-SAKI. Ukugcinwa kwezixhobo kufuna ukusetyenziswa kwezinto ezisetyenziswayo ezichazwe kwimizi-mveliso yokuqala. Ukuguqulwa okungagunyaziswanga kunokuchaphazela ukuchaneka kokufunyanwa