vitrox 3d x-ray machine v810

Vitrox 3D X-ray V810 has a variety of functions and advantages, mainly including high-speed detection, powerful test algorithms, intelligent programming, multiple platform support, extended X-ray tube duration, reduced radiation damage risk, etc.

Function

V810 has high-speed detection function and can quickly complete high-speed detection tasks.

Powerful test algorithm: Its test algorithm ensures that all solder joints can be fully inspected with high coverage, especially suitable for products such as servers and automotive electronics

Smart programming: Supports lightning programming to achieve intelligent and easy programming

Multiple platform support: Suitable for circuit boards of different sizes to meet diverse detection needs

Extend X-ray tube sleep: Adopt closed tube design to reduce X-ray tube loss and improve equipment sleep

Reduce radiation damage risk: Reduce radiation damage to DRAM-type radiation through the entire test time

Advantages

Higher test subject rate: Ensure comprehensive inspection of all solder joints to ensure product quality

Reduce programming setting time ‌: Set POP focus areas and self-learning functions to reduce programming and initial setup time‌

‌Intelligent package database‌: All production boards consume configuration package database to improve detection efficiency and accuracy‌

Advanced slice image technology: Provide second-generation slice images and solder profile feature maps for troubleshooting

‌Patented composite automatic docking technology‌: Automatically dock the cutting layer to the required height without moving the X-ray tube or loading platform‌

3D CT image: Support 3D model viewing tools to provide richer image information

‌Image restoration function‌: Improve the accuracy of 2.5D images, so operators can make accurate judgments‌

‌Multiple solder joint type selection‌: Support more than 2 Advanced algorithms for 0 types of solder joints to improve detection accuracy

Phase shift technology: Improve the test accuracy and coverage of press-in plug-in connectors and through-hole device boards

Improved bubble detection accuracy: The new bubble algorithm improves the accuracy of bubble detection for various types of components

PTH detection: Comply with IPC via creep tin standards and provide detailed PTH pin height judgment

BGA detection: Increase the number of BGA solder ball cutting layers to improve HIP defect detection rate

Automatic defect judgment: Set the automatic judgment function for defective solder joints to reduce the workload of manual re-judgment