en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Izinto eziluncedo kunye neenkcukacha zeMPM yoShicilelo lwe-Elite ye-MPM zezi zilandelayo:
Iingenelo
Ukuchaneka okuphezulu: I-MPM Printing Machine Elite isebenzisa iteknoloji ephezulu kunye nezixhobo zokuqinisekisa umgangatho ophezulu wokuchaneka kwiinkcukacha kunye nemibala yepateni eprintiweyo.
Ubuchule obuphezulu: Uyilo olukrelekrele lwenza ukuba umatshini wokushicilela ufezekise utshintsho olukhawulezayo lwepleyiti kunye nohlengahlengiso oluzenzekelayo, ukuphucula kakhulu ukusebenza kakuhle kokushicilela kunye nokugcina ixesha kunye neendleko zabasebenzi.
Ukuzinza: Lawula ngokungqongqo umgangatho womatshini wokushicilela ngamnye ukuqinisekisa ukuzinza kunye nokuqina, nokuba kukusebenza ixesha elide okanye ukuprinta okuphezulu, kunokugcina ukusebenza okugqwesileyo.
Ukwahluka: Iindidi ezahlukeneyo zezixhobo zoshicilelo zinokulungiswa ngokweemfuno zabathengi ukuhlangabezana neemfuno zoshicilelo lwamashishini ahlukeneyo.
Iqela lobuGcisa: Ngeqela elinamava leenjineli kunye neengcali, sinokubonelela ngezisombululo zokwenza ngokwezifiso kunye nenkxaso yobugcisa
Iinkcukacha
Ukuphathwa kwesubstrate: Ubungakanani besubstrate enkulu 609.6mmx508mm (24”x20”), ubuncinane bobungakanani besubstrate 50.8mmx50.8mm (2”x2”), ubukhulu besubstrate ubukhulu 0.2mm ukuya 5.0mm (0.008” ukuya ku-0.20”), ubuninzi besubstrate ubunzima 4.5. (9.92lbs)
Iiparamitha zoshicilelo: Ubukhulu bendawo yoshicilelo 609.6mmx508mm (24”x20”), uluhlu lokubonisa print 0mm ukuya 6.35mm (0” ukuya 0.25”), isantya print 0.635mm/sec ukuya 304.8mm/sec (0.025in/sec ukuya 12in ), uxinzelelo lokushicilela 0 ukuya kwi-22.7kg (0lb ukuya 50lbs)
Ubungakanani besakhelo sesakhelo: 737mmx737mm (29”x29”), iitemplates ezincinci ziyafumaneka
Ulungelelwaniso oluchanekileyo kunye nokuphindaphinda: ± 12.5 microns (± 0.0005") @6σ, Cpk≥2.0*
Okwenziweyo kwi-solder paste ukuchaneka kunye nokuphindaphinda: ±20 microns (±0.0008”) @6σ, Cpk≥2.0*
Ixesha lomjikelo: imizuzwana eyi-9 yexesha eliqhelekileyo lomjikelo, imizuzwana eyi-7.5 yenguqulo ye-HiE
