I-Koh Young SPI 8080 yi-3D solder paste tester enezi mpawu zilandelayo kunye neenkcukacha:
Iimbonakalo
Ukuhlolwa okuchanekileyo okuphezulu: I-Koh Young SPI 8080 iyakwazi ukufezekisa uhlolo olukhawulezayo kwishishini ngelixa igcina ukuchaneka okuphezulu, kunye nesantya sokuhlola esipheleleyo se-3D ye-38.1 cm²/sec.
Isisombululo esiphezulu: Isixhobo sinesisombululo se-1.0um/pulse kwaye sisebenzisa ikhamera ye-4-megapixel yokufumana umfanekiso
I-Versatility: Iyakwazi ukulinganisa ubukhulu be-solder kunye novavanyo lwe-3D, amaxabiso okulinganisa anokurekhodwa, agcinwe kwaye aprintwe, kwaye anokumelana nokungcangcazela okuqinileyo.
Iinkcukacha IiParameters Iimfuno zobonelelo lwamandla: 200-240VAC, 50/60Hz isigaba esisodwa
Iimfuno zomthombo womoya: 5kgf/cm² (0.45MPa), 2Nl/min (0.08cfm)
Ubunzima: 600kg
Imilinganiselo: 1000x1335x1627mm
Ubungakanani bePCB: 50×50~510×510mm
Uluhlu lokulinganisa: 0.6mm ~ 5.0m
Ukuchaneka kobude: 1μm (imodyuli yokulungisa)
Ubungakanani obukhulu bokubona: 10 × 10 mm
Iimeko zesicelo kunye nolwazi lwexabiso
I-Koh Young SPI 8080 ilungele imigca yemveliso ye-SMT ukuze ibonwe ngokuchanekileyo kunye nokulawulwa komgangatho wobunzima be-solder paste.