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id
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lao
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The SAKI 3Di-MS3 designation belongs to the M-size 3D AOI family. The key distinction when assessing this format is the PCB envelope: SAKI’s published specifications for the related 3Di-MS3EX list board sizes from 50 × 60 mm to 330 × 330 mm.
Three-dimensional inspection adds height information to optical images, allowing the inspection program to assess component position and solder-joint features in more than two dimensions. This is particularly relevant when visual appearance alone does not provide enough information to evaluate a component or joint.
The exact suffix matters when comparing machines. The published MS3EX specification lists 8 μm and 15 μm resolution options, a main-body size of approximately 850 × 1,480 × 1,500 mm and a weight of about 850 kg. These values are documented for the EX model and should not automatically be assigned to a machine labeled only 3Di-MS3.
Προδιαγραφές
| Είδος | Προσδιορισμός |
|---|---|
| Μάρκα | SAKI |
| Μοντέλο | 3Di-MS3 |
| Inspection Method | 3D optical inspection |
| Machine Format | M-size |
| Optical Resolution | Confirm exact model generation |
| Εύρος μεγέθους PCB | Confirm exact model generation |
| Διαστάσεις | Confirm exact model generation |
| Βάρος | Confirm exact model generation |
| Camera and Optional Hardware | Confirm installed configuration |
| Power Requirements | Refer to machine nameplate |
