en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
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ukr
urd
vie
wel
xho
The SAKI 3Di-MS3 designation belongs to the M-size 3D AOI family. The key distinction when assessing this format is the PCB envelope: SAKI’s published specifications for the related 3Di-MS3EX list board sizes from 50 × 60 mm to 330 × 330 mm.
Three-dimensional inspection adds height information to optical images, allowing the inspection program to assess component position and solder-joint features in more than two dimensions. This is particularly relevant when visual appearance alone does not provide enough information to evaluate a component or joint.
The exact suffix matters when comparing machines. The published MS3EX specification lists 8 μm and 15 μm resolution options, a main-body size of approximately 850 × 1,480 × 1,500 mm and a weight of about 850 kg. These values are documented for the EX model and should not automatically be assigned to a machine labeled only 3Di-MS3.
מפרטים
| פָּרִיט | מִפרָט |
|---|---|
| מותג | SAKI |
| דֶגֶם | 3Di-MS3 |
| Inspection Method | 3D optical inspection |
| Machine Format | M-size |
| Optical Resolution | Confirm exact model generation |
| טווח גודל PCB | Confirm exact model generation |
| מידות | Confirm exact model generation |
| מִשׁקָל | Confirm exact model generation |
| Camera and Optional Hardware | Confirm installed configuration |
| Power Requirements | Refer to machine nameplate |
