SAKI 3Di-LS3 3D AOI Machine | PCB Height Measurement

The SAKI 3Di-LS3 is a 3D automated optical inspection machine in SAKI’s 3Di range. Its main inspection advantage is the use of three-dimensional measurement data alongside high-resolution optical imaging, allowing the inspection process to assess both component appearance and height-related characteristics on assembled PCBs.

SAKI’s 3D AOI technology is designed to inspect small components as well as narrow-pitch ICs and pads. The company’s published 3Di-series information describes camera options including 8 μm and 15 μm resolution on newer EX-series configurations, as well as an expanded height-measurement range when a Z-axis option is fitted. These specifications should not automatically be attributed to every 3Di-LS3 unit; the exact camera and hardware configuration must be verified.

The LS designation identifies a larger machine format within the 3Di model family. Board dimensions, component clearance and conveyor arrangement are important when assessing whether a particular unit can accommodate the assemblies used on a production line. Inspection speed also depends on camera resolution, board complexity and the inspection program.

For purchasing or line-planning purposes, confirm the machine’s installed optical unit, supported PCB size and any optional hardware against its serial-number-specific documentation.

Spezifikatioune

Configuration Notes

Do not substitute specifications for the newer 3Di-LS3EX model for the 3Di-LS3 without checking the actual machine configuration. Confirm optical resolution, board-size limits and optional Z-axis hardware before publishing definitive technical values.