ASMPT's AUTOPIA-TCT ye nkola ya die bonder. AUTOPIA-TCT ye die bonder ewereddwa ASMPT, okusinga ekozesebwa mu kupakinga semiconductor overall solutions. Ebyuma bino birina ebintu bino wammanga:
FOV okutuuka ku 2100 mu kiseera ky’okugezesa, esobola okuwa ebyava mu kukebera mu butuufu obw’amaanyi.
Diguli 11 ez’eddembe, ekiyinza okulongoosa omutindo gw’okupima.
Ensengeka eziteekebwateekebwa ennyo, ezisaanira ebyetaago by’okufulumya eby’enjawulo.
Kyangu okukyusa wakati w’ensengekera z’okufulumya ez’obunene oba eza UPH ennene okulongoosa obulungi bw’okufulumya.
Okuwa enkola nnyingi ezitegeezeddwa abakozesa okusobola okutuukiriza ebyetaago by’okufulumya eby’enjawulo.
Sensor levelling erongoosa nnyo ebivudde mu calibration era ekakasa obutuufu bw’okugezesa.
Okutikka/okutikkula mu ngeri ey’obwengula era entuufu okusobola okufulumya amaanyi amangi.
Asobola okugaziwa okukozesebwa ku yintaneeti okusobola okutuukagana n’embeera ez’enjawulo ez’okufulumya.
Obuyonjo mu kukola ebintu butuuka ku kiraasi 100 okulaba ng’obutonde bw’ebikolebwa buba buyonjo.