en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
I-AUTOPIA-TCT ye-ASMPT yi-die bonder. I-AUTOPIA-TCT yi-die bonder ebonelelwa yi-ASMPT, ikakhulu isetyenziselwa ukupakishwa kwe-semiconductor kwizisombululo zonke. Isixhobo sinezi mpawu zilandelayo:
I-FOV ukuya kuthi ga kwi-2100 ngexesha lovavanyo, ekwaziyo ukubonelela ngeziphumo zovavanyo oluchanekileyo.
I-11 degrees yenkululeko, enokuphucula umgangatho wokulinganisa.
Izicwangciso eziqwalaselwe kakhulu, ezifanelekileyo kwiimfuno ezahlukeneyo zemveliso.
Ukutshintshela ngokulula phakathi komthamo ophezulu okanye ulandelelwano lwemveliso ephezulu ye-UPH ukuphucula ukusebenza kakuhle kwemveliso.
Ukubonelela ngoluhlu olubanzi lweeparamitha zenkqubo echazwe ngumsebenzisi ukuhlangabezana neemfuno ezahlukeneyo zemveliso.
Umgangatho woluvo uphucula kakhulu iziphumo zolungelelwaniso kwaye uqinisekisa ukuchaneka kovavanyo.
Ukulayisha / ukulayishwa okuzenzekelayo kunye nokuchanekileyo kwimveliso ephezulu.
Inokwandiswa ukuze isetyenziswe kwi-intanethi ukuqhelanisa neemeko ezahlukeneyo zemveliso.
Ucoceko lwemveliso lufikelela kwiKlasi ye-100 ukuqinisekisa ukucoceka kwendawo yokuvelisa.
