VCTA-V850 ye solder paste thickness detector, nga esinga kukozesebwa okuzuula obuwanvu bwa solder paste n’okukakasa omutindo gw’okulongoosa patch.
Emirimu n’Emirimu
Emirimu emikulu egya VCTA-V850 mulimu:
Okuzuula obuwanvu bw’ekikuta kya solder: Okuyita mu kkamera ez’amaanyi, ez’amaanyi nga zirina lenzi ezikwata ku ssimu eziyitibwa high-field telecentric, okupima obulungi obuwanvu bwa solder paste kituukibwako.
High frame rate shooting: Tekinologiya wa GPU large-scale parallel akozesebwa okulongoosa sipiidi y’okubalirira n’okuzuula, n’okukola obulungi ku bizibu nga FPC warping.
Okwolesebwa kw’ebifaananyi eby’ekika kya stereo mu bitundu bisatu: Tekinologiya w’okupima ekifaananyi kya phase modulation profile (PMP) akozesebwa okufuna ebivudde mu kupima enkula y’ebintu ebituufu ennyo n’obunene, n’okulaga ebifaananyi bya stereo eby’ebitundu bisatu ebya langi entuufu.
Module ezikola emirimu egy’enjawulo: Omuli okuzuula ggaamu emmyufu, okukola pulogulaamu y’okuyiga olubaawo olutaliiko kintu kyonna, okuliyirira okubeebalama kw’olubaawo mu ngeri ey’otoma, okutegeera bbaakoodi za kkamera, okukola pulogulaamu ezitali ku mutimbagano n’okulongoosa n’emirimu emirala.
Ebipimo by’ebyekikugu
Okusalawo okuzuula: okusalawo kwa 8-bit grayscale, okutuuka ku kuzuula okusalawo kwa 0.37 microns.
Obusobozi bw’okuzuula: Bw’ogeraageranya n’obutuufu bw’okupima layisi, obutuufu bulongoosebwa n’ebiragiro 2 eby’obunene, ekirongoosa ennyo obusobozi bw’okuzuula n’obuwanvu bw’okukozesa ebyuma.
Display effect: Okwettanira ensibuko y’ekitangaala eya langi ssatu eya RGB eyeekola, ebifaananyi ebya langi entuufu ebya 3D ne 2D bituukirira, era ekikolwa eky’okulaga kiri kumpi nnyo n’ekintu ekituufu.
Ensonga y’okusaba
VCTA-V850 esaanira omulimu gw’okukola ku SMT patch naddala mu kifo ekyetaagisa okuzuula obuwanvu bwa solder paste mu ngeri entuufu. Ennyonyola yaayo eya waggulu n’obutuufu bwayo obw’amaanyi bigifuula okuba n’essuubi ery’okukozesebwa mu mulimu gw’okukola ebyuma bikalimagezi
SMT solder paste thickness tester esobola okuzuula embeera zino wammanga ezitayagalwa:
Volume y’okukuba solder paste etamala oba esukkiridde: Nga tupima obuwanvu bwa solder paste, kiyinza okusalibwawo oba volume y’okukuba solder paste etuukana n’omutindo, okwewala ekizibu kya solder paste obutamala ekivaako welding etali nnywevu oba solder paste eyitiridde okuleeta short circuit.
Solder paste printing height deviation: Omugezesa asobola okupima obuwanvu bwa solder paste n’azuula oba waliwo ebintu ebitali bimu nga pulling tip n’okugwa, ekijja okukosa omutindo gw’okuweta.
Ekitundu oba obuzito bw’okukuba solder paste obutamala: Nga tupima ekitundu n’obunene bwa solder paste, kiyinza okusalibwawo oba solder paste ebikka paadi kyenkanyi, okwewala embeera ya solder obutasalako oba okuweta okutali kunywevu mu kiseera ky’okuweta.
Solder paste printing flatness problem: Omugezesa asobola okuzuula okugenda mu maaso, okugwa, n’okugwa kwa solder paste ku PCB pad, ekijja okukosa omutindo gw’okuweta.