Okunoonya amangu
SAKI 3Si-MS2 nkola empya ey’okukebera solder paste mu ngeri ya 3D (SPI) eyatongozebwa kkampuni ya SAKI. Yeettanira tekinologiya omuyiiya ow’okupima ebipimo ebingi era nga ekoleddwa ku mutindo con...
SAKI 3Si-LS2 ye kyuma eky’omulembe eky’okukebera solder paste (SPI) ekikozesa tekinologiya wa laser triangulation era nga kikoleddwa okulondoola omutindo gw’enkola y’okukuba solder paste mu ngeri entuufu
SAKI 3Si-LS3EX ye nkola ya 3D ey’omulembe ey’okukebera solder paste (SPI) eyatongozebwa kkampuni ya SAKI eya Japan. Ekwata tekinologiya w’okukuba ebifaananyi mu ngeri ey’enjawulo (multi-spectral confocal imaging technology).
SAKI BF-3Si-L2 ye nkola ya 3D 3D solder paste inspection system (SPI) eyatongozebwa SAKI eya Japan, eyakolebwa mu ngeri ey’enjawulo okulondoola omutindo gw’okukuba solder paste proce...
Ewa okwekebejja okujjuvu okwa 3D, era okusalawo okw’amaaso kuyinza okulondebwa nga 10μm oba 15μm okukakasa ebivudde mu kwekebejja mu butuufu obw’amaanyi.
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Omukulembeze w'okugonjoola ensonga emu ku chip mounter
Ebitukwatako
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ekyamaguzi
SAKI AOI ekyuma kya smt Ebyuma bya semiconductor ekyuma kya pcb Ekyuma kya Label ebyuma ebiralaSMT layini eky'okugonjoola
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