Ukukhangela ngokukhawuleza
I-SAKI 3Si-MS2 sisizukulwana esitsha se-3D yenkqubo yokuhlola i-solder paste (SPI) esungulwe ngu-SAKI. Yamkela itekhnoloji yokulinganisa i-multi-spectral kwaye yenzelwe ukuhambelana nomgangatho ...
I-SAKI 3Si-LS2 sisixhobo sokuhlola ukuncamathisela kwe-3D ephucukileyo (SPI) esebenzisa itekhnoloji yelaser triangulation kwaye iyilelwe inkqubo yoshicilelo lwenkqubo yoshicilelo oluchanekileyo.
I-SAKI 3Si-LS3EX yinkqubo yokuhlola i-solder paste yamva nje ye-3D (SPI) esungulwe ngu-SAKI waseJapan. Yamkela itekhnoloji yokucinga ye-multi-spectral confocal
I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D echanekileyo ephezulu (SPI) esungulwe ngu-SAKI waseJapan, eyilelwe ngokukodwa ukulawula umgangatho wenkqubo yokushicilela i-solder paste...
Ibonelela ngohlolo olupheleleyo lwe-3D, kwaye isisombululo se-optical sinokukhethwa njenge-10µm okanye i-15µm ukuqinisekisa iziphumo zokuhlolwa ezichanekileyo.
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
SAKI AOI umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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