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VCTA-V850 3D SPI Solder Paste Inspection Machine

VCTA-V850 3D SPI Solder Paste Inspection Machine

Enquire about the VCTA-V850 3D SPI machine. Confirm camera specifications, PCB capacity, inspection software and printer interface availability.

Talba Mgħaġġla Email:smt-sales9@gdxinling.cn
Dettalji

The VCTA-V850 is a 3D solder paste inspection machine positioned after stencil printing and before component placement. At this stage, the inspection task centres on the printed deposit: its volume, height, area and position relative to the pad.

A useful SPI evaluation starts with the defects the factory needs to control. Low paste volume on fine-pitch pads, excess deposits and printing offsets call for different inspection limits. The review process matters as well, particularly how operators examine flagged pads and distinguish a printing defect from a false call.

For a VCTA-V850 enquiry, send us the PCB dimensions, smallest pad geometry and required line cycle time. Camera specifications, measurement capability, software functions and any printer communication interface should be confirmed against the individual machine before an order is placed.

VCTA-V850 3D SPI

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Indirizz ta' kuntatt:Nru 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, Ċina

Numru tat-telefon għall-konsultazzjoni:+86 13823218491

Email:smt-sales9@gdxinling.cn

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