universal pick and place machine Fuzion

Specifications for the Universal Instruments Fuzion Chip Bonder are as follows:

‌ Placement Accuracy and Speed:

‌ Placement Accuracy: Maximum accuracy is ±10 microns with < 3 microns repeatability.

‌ Placement Speed: Up to 30K cph (30,000 wafers per hour) for surface mount applications and up to 10K cph (10,000 wafers per hour) for advanced packaging.

‌ Processing Capabilities and Applications:

‌ Chip Type: Supports a wide range of chips, flip chips, and a full range of wafer sizes up to 300mm.

‌ Substrate Type: Can be placed on any substrate including film, flex, and large boards.

‌ Feeder Type: A wide range of feeders are available including high-speed wafer feeders.

‌ Technical Features and Functions:

‌ High Precision Servo Driven Pick Heads: 14 high precision (sub-micron X, Y, Z) servo driven pick heads.

‌ Vision Alignment‌: 100% pre-pick vision and die alignment‌.

‌ One-step Switching‌: One-step wafer to die switching‌.

‌ High-Speed Processing‌: Dual wafer platform, up to 16K wafers per hour (flip chip) and 14,400 wafers per hour (non-flip chip).

‌ Large Size Processing‌: Maximum substrate processing size is 635mm x 610mm, and maximum wafer size is 300mm (12 inches).

‌ Versatility‌: Supports up to 52 types of chips, automatic tool changer (nozzle and ejector), size range from 0.1mm x 0.1mm to 70mm x 70mm.

These specifications reflect the superior performance of Universal Fuzion chip mounters in terms of accuracy, speed and processing power, suitable for a variety of chip and substrate types, with high flexibility and versatility

‌The advantages of Universal Instruments Fuzion series chip mounters mainly include the following aspects‌:

‌High accuracy and high speed‌: FuzionSC semiconductor mounters have extremely high accuracy (±10 microns) and speed (up to 10K cph), capable of processing large-area substrates in extremely high-speed surface mount production lines, while mounting components of any type and shape‌. In addition, FuzionSC's feeder can reach 16K pieces per hour, further improving production efficiency‌.

‌Extensive component handling capabilities‌: FuzionSC can handle components of various sizes, including chips from 0.1mm x 0.1mm to 70mm x 70mm, suitable for a variety of application scenarios‌. The FuzionXC series placement machine has up to 272 8mm feeder stations, which can handle a variety of products at the same time, supporting components ranging from 01005 to 150 square millimeters and 25 mm high, including press-fit parts, connectors, micro BGA, etc.