universal pick kunye nendawo machine Fuzion

Iinkcukacha ze-Universal Instruments Fuzion Chip Bonder zimi ngolu hlobo lulandelayo:

Ukuchaneka kokubekwa kunye nesantya:

Ukuchaneka kokubekwa: Ukuchaneka okuphezulu yi-± 10 microns kunye ne-< 3 microns ukuphindaphinda.

Isantya sokubeka: Ukuya kuthi ga kwi-30K cph (ii-wafers ezingama-30,000 ngeyure) kwizicelo zokunyuka komphezulu kunye nokuya kuthi ga kwi-10K cph (ama-wafers angama-10,000 ngeyure) yokupakishwa okuphezulu.

Ukuqhuba izakhono kunye nezicelo:

Uhlobo lweChip: Ixhasa uluhlu olubanzi lweetshiphusi, iichips zeflip, kunye noluhlu olupheleleyo lweesayizi ze-wafer ukuya kuthi ga kwi-300mm.

Uhlobo lwe-Substrate: Inokubekwa kuyo nayiphi na i-substrate kuquka ifilimu, i-flex, kunye neebhodi ezinkulu.

Uhlobo lwe-Feeder: Uluhlu olubanzi lwezondla ziyafumaneka kuquka i-wafer feeders enesantya esiphezulu.

Iimpawu zobuGcisa kunye neMisebenzi:

I-High Precision Servo Driven Pick Heads: I-14 echanekileyo ephezulu (i-sub-micron X, Y, Z) iintloko ze-servo eziqhutywayo.

Ulungelelwaniso lombono: I-100% yokukhetha umbono kunye nokulungelelanisa ukufa.

Inyathelo elinye Ukutshintsha: Inyathelo elinye le-wafer yokufa ukutshintsha.

I-High-Speed ​​Processing: Iqonga le-wafer eliphindwe kabini, ukuya kuthi ga kwi-16K yafers ngeyure (flip chip) kunye ne-14,400 yafers ngeyure (non-flip chip).

Ukucutshungulwa kobungakanani obukhulu: Ubungakanani bobungakanani be-substrate ephezulu yi-635mm x 610mm, kwaye ubukhulu besayizi ye-wafer yi-300mm (i-intshi eziyi-12).

I-Versatility: Ixhasa ukuya kwii-52 iintlobo ze-chips, i-tool converter ngokuzenzekelayo (i-nozzle kunye ne-ejector), ububanzi besayizi ukusuka kwi-0.1mm x 0.1mm ukuya kwi-70mm x 70mm.

Ezi nkcukacha zibonisa ukusebenza okuphezulu kwe-Universal Fuzion chip mounters ngokuchaneka, isantya kunye namandla okusebenza, alungele iindidi zetshiphu kunye ne-substrate, enokuguquguquka okuphezulu kunye nokuguquguquka.

Izinto eziluncedo ze-Universal Instruments Fuzion series mounters zibandakanya ikakhulu le miba ilandelayo:

Ukuchaneka okuphezulu kunye nesantya esiphezulu: I-FuzionSC semiconductor mounters inokuchaneka okuphezulu kakhulu (± 10 microns) kunye nesantya (ukuya kuthi ga kwi-10K cph), ekwaziyo ukucubungula i-substrates yendawo enkulu kwimigca yokuvelisa isantya esiphezulu kakhulu, ngelixa inyusela izixhobo zalo naluphi na uhlobo. kunye nokumila. Ukongeza, iFuzionSC's feeder inokufikelela kwiziqwenga eziyi-16K ngeyure, iphucula ngakumbi ukusebenza kakuhle kwemveliso.

Amandla okuphatha amacandelo amaninzi: I-FuzionSC inokusingatha amacandelo obungakanani obuhlukeneyo, kubandakanywa iichips ukusuka kwi-0.1mm x 0.1mm ukuya ku-70mm x 70mm, ezifanelekileyo kwiimeko ezahlukeneyo zesicelo. Umatshini wokubeka uchungechunge lwe-FuzionXC unokufikelela kwi-272 8mm izikhululo ze-feeder, ezinokusingatha iintlobo zeemveliso ngexesha elinye, izinto ezixhasayo ukusuka kwi-01005 ukuya kwi-150 ye-square millimeters kunye ne-25 mm ukuphakama, kubandakanywa neengxenye ze-press-fit, izixhumi, i-micro BGA, njl.