en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
JT KTD-1204-N Product Overview
The JT KTD-1204-N combines nitrogen-atmosphere soldering with dual-rail PCB transport. It supports SMT production where board flow, thermal profiling and oxygen control need to work together through the reflow process.
Nitrogen Atmosphere and Thermal Control
Nitrogen helps limit oxidation during soldering. The KT platform incorporates nitrogen management and oxygen monitoring alongside hot-air heating, allowing the atmosphere and temperature recipe to be adjusted around the assembly process.
For boards containing components with different thermal masses, the temperature settings and conveyor speed work together to establish the required profile. The production recipe should follow measured PCB temperatures and the solder paste manufacturer’s process window.
Dual-Rail Board Transport
The dual-rail arrangement brings two PCB transport paths into one oven. Its value depends on the upstream line layout, board dimensions and required dwell time through the heated section.
Conveyor speed control is an important configuration detail when evaluating the KTD-1204-N. The installed drive arrangement determines how the two transport paths can be coordinated with production.
Flux Collection and Routine Maintenance
The KT series features two-stage flux separation with collection at multiple points. Collecting flux residues helps manage contamination within the oven and provides defined areas for routine cleaning.
For continuous production, the condition of the collection system, circulation equipment and conveyor rails matters alongside heating performance. We review these assemblies and the nitrogen-system configuration when preparing the equipment offer.
JT KTD-1204-N Core Technical Specifications
| Halbeegga | Tilmaamid |
|---|---|
| Qaabka | KTD-1204-N |
| Product Series | JT KT Series |
| Equipment Type | Inline reflow soldering oven |
| Soldering Process | Lead-free hot-air reflow |
| Process Atmosphere | Nitrogen |
| PCB Transport | Dual rail |
| Temperature Setpoint-to-Actual Deviation | Within 1.0°C, published KT-series figure |
| Loaded / Unloaded Temperature Fluctuation | Within 1.5°C, published KT-series figure |
| Component Clearance | PCB top: 30 mm / bottom: 25 mm, KT-series reference |
| Flux Collection | Two-stage separation with multi-point collection |
Series figures are reference specifications. The quotation confirms the individual machine’s electrical requirements, conveyor configuration and installed options.
Contact us with your PCB dimensions, line arrangement and nitrogen-process requirements for equipment details and pricing.
