Ukukhangela ngokukhawuleza
imveliso FAQ
Ubuncinane becandelo: 01005 ~ 55mm(H 15mm)
Umatshini wokubekwa kweHYbrid3 uxhasa iindlela ezahlukeneyo zokupakisha izinto, kubandakanya iteyiphu kunye nereel, ityhubhu, ibhokisi kunye netreyi.
I-ASM AD832i die bonder iphucula kakhulu impumelelo yemveliso ngokuqhutywa kwayo okusebenzayo kunye nokusebenza okuzenzekelayo
I-die bonder yenzelwe ukuba ibe bhetyebhetye kwaye inokuphatha ii-motherboards zobukhulu obahlukeneyo kunye neemilo
Isixhobo sisebenza ngokuchaneka okuphezulu kwaye sinokufikelela kulawulo oluchanekileyo lwe-±7um@3σ kunye ±1°@3σ.
I-wire bonder yenza kakuhle ekusebenzeni kwexesha elide kwaye inozinzo oluphezulu, olunokuqinisekisa ukuqhubeka nokuthembeka kwenkqubo yokuvelisa.
Ukuchaneka kwe-wire bonder yale ntambo yocingo ifikelela kwi-± 2 microns
I-AB589 ye-wire bonder sisixhobo sokubopha ucingo oluphezulu oluveliswe yi-ASMPT
I-ASMPT AERO CAM series wire bonder yenzelwe ngokukodwa ukupakishwa kwemodyuli yekhamera
I-AD8312 Plus yokubeka i-die bonder idibanisa iingenelo ze-ultra-fast kunye nokubeka
I-AD420XL die bonder yenzelwe ukusebenza kakuhle engqondweni kwaye inokubonelela ngezisombululo ze-high-speed die bonding.
I-ASM die bonder SD8312 ithatha iinkqubo zokulawula eziphambili kunye nezakhiwo zoomatshini
I-coplanarity ye-loop evaliweyo (TTV) ye-ORCAS inkqubo yokubumba ngesandla ingaphantsi kwe-20μm, iqinisekisa iziphumo zokuchaneka okuphezulu.
Ukusika okuphezulu ngokuchanekileyo: I-DFL7341 isebenzisa itekhnoloji yokusika engabonakaliyo ye-laser ukwenza umaleko olungisiweyo kuphela ngaphakathi kwe-silicon wafer.
I-DFD6341 isebenzisa indlela ekhethekileyo yokujikeleza, ukubuya kwesantya se-X axis kunyuswe ukuya kwi-1000 mm / s.
Inkqubo inokusingatha iinkqubo ezininzi ze-chip kunye neenkqubo ezininzi kumatshini omnye
Iimathiriyeli ekrwada eziza kuhlelwa zondliwa kwizibuko lokutya likamatshini wokuhlela ngebhanti lokuhambisa okanye ivibrator.
I-AD280 Plus die bonder ine-high-chane-chane ye-die bonding, enokuqinisekisa ukubekwa okuchanekileyo kwamacandelo.
Isantya sokubekwa kwayo sifikelela kwi-100,000 CPH, kunye ne-200,000 CPH kwezinye iimeko.
Le ntsebenzo yesantya esiphezulu yenza ukuba umatshini wokubeka i-TX2 uqhube kakuhle kwimveliso yobuninzi kwaye unokuphucula kakhulu ukusebenza kwemveliso
Isantya sokubekwa komatshini wokubekwa kwe-ASM X4S siphezulu kakhulu, kunye nesantya sethiyori ye-170,500 CPH.
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho