en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
I-Oven ye-Japan ETC Reflow RSV152M-613-LE yi-oven yokucoca ivacuum enezi mpawu zilandelayo kunye nemisebenzi:
Itekhnoloji ye-vacuum reflow: Isixhobo samkela itekhnoloji ye-vacuum reflow, enokunciphisa kakhulu i-voids kwi-solder kwaye iqinisekise umgangatho we-welding.
Indawo yobushushu bokufudumala: Ineendawo ezininzi zokufudumeza zobushushu, ezinokubonelela ngefuthe elifanayo lokufudumeza kunye nokunciphisa umahluko weqondo lobushushu kumphezulu wePCB, ilungele izinto ezahlukeneyo kunye neemfuno ezincinci zokuvelisa ibhetshi.
Ukukhuselwa kwendalo kunye nokusebenza kakuhle kweendleko: Yamkela umgaqo wokufudumeza ngemitha ye-infrared, eneempawu zobushushu obufanayo, i-ultra-low-low welding, akukho mahluko obushushu, akukho bushushu, iparameters zenkqubo ethembekileyo nezizinzileyo, iindleko eziphantsi zokusebenza, kwaye idibana nokukhuselwa kwendalo. iimfuno
Intsimi yesicelo: Isetyenziswa ngokubanzi kwinqwelomoya yaseYurophu naseMelika, i-elektroniki kunye nezinye iindawo, kwaye ilungele iimfuno ezahlukeneyo zokuwelda ezichanekileyo.
Sebenzisa iimeko kunye noncedo:
Ukunciphisa izinga elingenanto: Ngetekhnoloji ye-vacuum reflow, i-voids kwi-solder iyancipha kakhulu kwaye umgangatho we-welding uphuculwe.
Ubushushu obufanayo: Ukusebenzisa umgaqo wokufudumeza ngemitha ye-infrared ukuqinisekisa ukuba umahluko wobushushu kumphezulu we-PCB mncinci kakhulu, ulungele iimfuno zokuwelda ezichanekileyo.
Ukukhuselwa kwendalo kunye neendleko eziphantsi: Iiparamitha zenkqubo zithembekile kwaye zizinzile, iindleko zokusebenza ziphantsi, zihlangabezana neemfuno zokukhusela okusingqongileyo, kwaye zifanelekile ukusetyenziswa kwexesha elide.
