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Ukukhangela ngokukhawuleza

I-TDK yodidi lweshishini loshicilelo lwentloko ye-thermal LH6409AK

I-TDK LH6409AK yi-ultra-high-speed-high-speed industrial-grade head print thermal head eyenzelwe iimeko zoshicilelo eziphezulu ezifana nemigca yemveliso ezenzekelayo, ukuhlelwa kwezinto, kunye neenkqubo zemali.
I-TDK Industrial Thermal Print Head LH4437K

I-TDK LH4437K yintloko echanekileyo yoshicilelo oluphezulu lweshishini
SHEC thermal printhead 203dpi

I-SHEC 203dpi series i-balanced thermal print head eyenzelwe iimfuno zoshicilelo lwexabiso eliphezulu.
I-SHEC Industrial Thermal PrintHead 300dpi

I-SHEC 3U105-8529 yintloko yoshicilelo lwe-300dpi ye-thermal eyenzelwe ukuchaneka okuphezulu kweshishini.
ROHM Thermal Transfer Overprint printhead

I-ROHM (TTO) (i-Thermal Transfer Overprint) isitampu sentloko yolunye uhlobo lokuhlelwa komhla, isitampu soqinisekiso, isitampu esichanekileyo esichanekileyo esisetiyelwe ngokuchaneka okuphezulu kwe-thermal setampu yokuseta inani eliguquguqukayo.
I-ROHM Industrial Thermal PrintHead

I-ROHM ye-thermal printhead (i-STPH series) yinto esebenzayo kunye nethembekileyo yoshicilelo lwe-thermal component.
ROHM Smart Thermal Printhead STPH

I-STPH ye-ROHM (i-Smart Thermal Printhead) i-series printhead yinxalenye engundoqo esekelwe kwi-teknoloji yokushicilela i-thermal.
Rohm thermal printhead 203dpi

Intloko yoshicilelo ye-ROHM's 203dpi yintloko yoshicilelo lwe-thermal-resolution ephakathi (TPH) enikezelwe kwitekhnoloji yoshicilelo olushushu.
SAKI 3D ooi umatshini 3Di MS2

I-SAKI 3Di MS2 iye yaba sisixhobo esibalulekileyo sokulawula umgangatho kwimigca yemveliso ye-SMT yangoku kunye nokuchaneka kwayo okuphezulu kwe-3D + i-algorithm yobukrelekrele ye-AI.
I-SAKI 3D AOI SMT Umatshini woHlolo oluSebenzayo oluSebenzayo lwe-3Di MD2

I-SAKI 3Di MD2 sisixhobo sokuhlola okuzenzekelayo se-3D esisebenza ngokukhawuleza (AOI) esasungulwa ngu-SAKI waseJapan. Yenzelwe ukwenziwa kwe-elektroniki yale mihla kwaye isetyenziselwa ukuhlolwa komgangatho ophezulu...
SAKI smt 3D SPI machine 3Si-LS3EX

I-SAKI 3Si-LS3EX yinkqubo yokuhlola i-solder paste yamva nje ye-3D (SPI) esungulwe ngu-SAKI waseJapan. Yamkela itekhnoloji yokucinga ye-multi-spectral confocal
SAKI BF-3Si-L2 SMT 3D SPI Machine

I-SAKI BF-3Si-L2 yinkqubo yokuhlola i-solder ye-3D echanekileyo ephezulu (SPI) esungulwe ngu-SAKI waseJapan, eyilelwe ngokukodwa ukulawula umgangatho wenkqubo yokushicilela i-solder paste...

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Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukuqalwa kweTshayina ngetekhnoloji yokusika. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

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Idilesi yoqhagamshelwano:No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

Inombolo yefowuni yokubonisana:+86 13823218491

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