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Imisebenzi ephambili kunye neziphumo ze-Mirtec SPI MS-11e ziquka le miba ilandelayo:
Ukubona ukuchaneka okuphezulu: I-Mirtec SPI MS-11e ixhotyiswe ngekhamera ye-15-megapixel, ekwazi ukufikelela kwi-3D echanekileyo yokuchongwa, kunye nesisombululo sokuphakama kwe-0.1μm, ukuchaneka kobude be-2μm, kunye nokuphindaphinda ukuphakama kwe-± 1% .
Imisebenzi yokufumanisa emininzi: Isixhobo sinokubona umthamo, indawo, ukuphakama, ulungelelwaniso lwe-XY, ibhulorho, njl njl. ye-solder paste, kwaye inokuhlawula ngokuzenzekelayo ukugoba kwe-substrate ukuqinisekisa ubhaqo oluchanekileyo kwii-PCB ezigobileyo.
Uyilo oluphezulu lwe-optical: I-Mirtec SPI MS-11e yamkela ukuqikelelwa kabini kunye noyilo lwe-ripple yesithunzi ukuphelisa izithunzi zokukhanya okukodwa kunye nokufezekisa iziphumo ezichanekileyo zokufumanisa i-3D. Uyilo lwelensi yekhompawundi ye-telecentric iqinisekisa ukukhulisa rhoqo kwaye akukho parallax.
Utshintshiselwano lwedatha yexesha lokwenyani: I-MS-11e inenkqubo evaliweyo ekwaziyo ukuqonda unxibelelwano lwexesha lokwenyani phakathi kwabashicileli/abakhweli, badlulisele ulwazi lwendawo yokuncamathelisa i-solder komnye nomnye, ngokusisiseko ukusombulula ingxaki yoshicilelo lwe-solder olulambathayo, nokuphucula umgangatho wemveliso. kunye nokusebenza kakuhle.
Umsebenzi wokulawula kude: Isixhobo sinenkqubo yokudibanisa i-Intellisys eyakhelwe-ngaphakathi exhasa ulawulo olude, ukunciphisa ukusetyenziswa kwabasebenzi, kunye nokuphucula ukusebenza kakuhle. Xa iziphene zenzeka kumgca wemveliso, inkqubo inokuthintela nokulawula kwangaphambili.
Uluhlu olubanzi lwezicelo: I-Mirtec SPI MS-11e ifanelekile kwi-SMT yokukhangela isiphene se-solder paste, ngakumbi kwishishini lokuvelisa i-electronics efuna ukuchongwa okuphezulu.
Zeziphi ezona ndawo ziphambili ze-SMT solder paste umvavanyi wokuqina ukuze zibonwe?
Umvavanyi wobungqingqwa be-solder ye-SMT ibona ikakhulu le miba ilandelayo:
I-Solder paste ubukhulu: Umvavanyi unokulinganisa ubukhulu be-solder paste eprintwe kwibhodi ye-PCB, kubandakanywa neerekhodi zesiphumo sobukhulu, ixabiso eliphakathi, inqaku eliphezulu kunye neyona ndawo iphantsi.
Indawo kunye nomthamo: Ukongeza kumlinganiselo wobunzima, umvavanyi unokulinganisa indawo kunye nomthamo we-solder paste ukunceda ukuvavanya ukuhanjiswa kwe-solder paste.
Ubude nobubanzi be-XY: Ubude nobubanzi kwicala le-XY bunokulinganiswa ukunika ulwazi olubanzi olunemilinganiselo.
Uhlalutyo lwecandelo elinqamlezileyo: Kubandakanya ukuphakama, indawo ephezulu, indawo enqamlezileyo, ukulinganisa umgama, njl., Ukunceda ukuhlalutya iimpawu ezinqamlezayo ze-solder paste.
Umlinganiselo we-2D: njengomgama, uxande, isangqa, i-ellipse, ubude, ububanzi, indawo, njl., Ukubonelela ngedatha ecacileyo kwinqwelo-moya emacala amabini.
Umlinganiselo we-3D: kubandakanywa umlinganiselo wobude obuhlengahlengiswayo, umfanekiso we-3D ujikelezo olupheleleyo, ukuguqulelwa, ukusondeza kunye neminye imisebenzi, ukuguqulelwa kwendawo yokubonisa kunye nokusondeza, ukunika ulwazi oluneenkcukacha kwisithuba esine-dimensional ezintathu.
