en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The CyberOptics QX600 uses strobed image acquisition to inspect assembled PCBs at 12 μm pixel resolution. Its inspection scope includes component presence, polarity, position and visible solder-joint defects.
Statistical Appearance Modeling evaluates the appearance of acceptable components and joints. This gives the platform a different programming approach from inspection systems that require extensive adjustment of individual algorithms.
The QX600 is a 2D inspection system. It evaluates visible features and should not be presented as a full 3D height-measurement machine.
We distinguish the standard QX600 from the larger-board and dual-lane variants when specifying board capacity and conveyor requirements.
CyberOptics QX600 Core Technical Specifications
| Parametr | Spesifikasiya |
|---|---|
| Model | QX600 |
| Yoxlama növü | Inline 2D AOI |
| Pixel Resolution | 12 μm |
| Published Typical Scanning Speed | 200 cm²/s |
| Minimum Component Size | 0402 metric / 01005 imperial |
| Standard PCB Length Range | 50–457 mm |
| Standard PCB Width Range | 50–308 mm |
| Maximum Top-Side Component Clearance | 35 mm |
| Minimum Bottom-Side Board Edge Clearance | 3 mm |
| Image Analysis | Statistical Appearance Modeling |
Scanning speed is not the complete board inspection cycle. Board coverage, inspection content and conveyor handling affect production throughput.
