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The Hybrid 3 has three trolley positions and can carry different combinations of placement robots. Compact Placement Robots and Standard Placement Robots divide the workload according to component handling and output requirements.
Adding a Twin Placement Robot changes the range of processes the machine can perform. With the corresponding feeding equipment, this configuration supports flip-chip work and pickup from wafers, waffle packs and trays.
The placement system includes force feedback and compensation for board-height variation. These features matter when components on the same assembly require different placement forces or when the board surface varies in height. SMT and flip-chip capability therefore depend on the installed robot and feeder combination.
