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Assembléon Hybrid 3 Pick and Place Machine

Assembléon Hybrid 3 Pick and Place Machine

Hybrid 3 assembly platform with configurable placement robots, force feedback and optional wafer feeding for boards combining SMT components and flip chips.

Gaaffii Saffisaa Email:smt-sales9@gdxinling.cn
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The Hybrid 3 has three trolley positions and can carry different combinations of placement robots. Compact Placement Robots and Standard Placement Robots divide the workload according to component handling and output requirements.

Adding a Twin Placement Robot changes the range of processes the machine can perform. With the corresponding feeding equipment, this configuration supports flip-chip work and pickup from wafers, waffle packs and trays.

The placement system includes force feedback and compensation for board-height variation. These features matter when components on the same assembly require different placement forces or when the board surface varies in height. SMT and flip-chip capability therefore depend on the installed robot and feeder combination.

Philips Hybrid3 Pick-and-Place Machine

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Teessoo quunnamtii:Lakk 18, Daandii Industirii Shangliao, Magaalaa Shaajing, Aanaa Baoan, Shenzhen, Chaayinaa

Lakkoofsa bilbilaa marii:+86 13823218491

Imeelii:smt-gurgurtaa9@gdxinling.cn irraa argattu

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