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Assembléon Hybrid 3 Pick and Place Machine

Assembléon Hybrid 3 Pick and Place Machine

Hybrid 3 assembly platform with configurable placement robots, force feedback and optional wafer feeding for boards combining SMT components and flip chips.

Okusaba okw'amangu Email:smt-sales9@gdxinling.cn
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The Hybrid 3 has three trolley positions and can carry different combinations of placement robots. Compact Placement Robots and Standard Placement Robots divide the workload according to component handling and output requirements.

Adding a Twin Placement Robot changes the range of processes the machine can perform. With the corresponding feeding equipment, this configuration supports flip-chip work and pickup from wafers, waffle packs and trays.

The placement system includes force feedback and compensation for board-height variation. These features matter when components on the same assembly require different placement forces or when the board surface varies in height. SMT and flip-chip capability therefore depend on the installed robot and feeder combination.

Philips Hybrid3 Pick-and-Place Machine

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Endagiriro y’okutuukirira:No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:+86 13823218491

Email:smt-okutunda9@gdxinling.cn

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