en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The AC-420 is listed for cleaning semiconductor packaging assemblies after soldering, with lead-frame and IGBT-related products included in its stated application scope. The process objective is to address residual flux and contamination before the next manufacturing step.
Cleaning access is particularly important around leads, joints and product carriers. The assembly materials and residue type determine which process conditions can be considered without compromising the product.
For an AC-420 enquiry, we focus on the package construction, soldering material and required cleanliness level. These details allow the cleaning method and handling arrangement to be reviewed against the actual product.
Public descriptions of this model contain conflicting references to wet cleaning and plasma cleaning. We therefore specify the process technology only after checking the machine documentation, and keep the quotation tied to the actual equipment configuration.
AC-420 Semiconductor Cleaning Machine Specifications
| פָּרִיט | פרטים |
|---|---|
| דֶגֶם | AC-420 |
| Listed production stage | Post-solder semiconductor packaging cleaning |
| Listed product examples | Lead-frame and IGBT-related assemblies |
| Target residue | Residual flux and process contamination |
| Cleaning technology | Must be confirmed from machine documentation |
| Capacity and product dimensions | Require verified specifications |
