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Chips and IC packages place different demands on alignment, pickup and mounting force. The Assembléon AX501 addresses these requirements through configurable placement robots and laser- or camera-based component alignment.
Laser alignment provides 40 μm placement accuracy. Camera alignment is specified at 35 μm with the Standard Placement Robot and 25 μm with the Twin Placement Robot, under the manufacturer’s stated conditions.
Controlled placement and flexible material supply
Placement force is programmable from 1.5 to 8 N. Automatic compensation addresses component-thickness and board-height variation, including warpage.
Exchangeable feeder trolleys support product changeover. Available supply formats include tape, sticks and JEDEC tray stackers. The optional TPR configuration adds IC-placement capacity and tray-handling capability.
The AX501 accommodates components from 01005 chips to 45 × 45 mm packages, with standard PCB handling up to 515 × 390 mm.
Key Equipment Specifications
| פָּרִיט | מִפרָט |
|---|---|
| דֶגֶם | Assembléon AX501 / AX-501 |
| Alignment systems | Laser and camera, configuration-dependent |
| Laser placement accuracy | 40 μm |
| Camera accuracy with SPR | 35 μm |
| Camera accuracy with TPR | 25 μm |
| Programmable placement force | 1.5–8 N |
| Component range | 0.4 × 0.2 to 45 × 45 mm |
| Standard maximum PCB | 515 × 390 mm |
| Standard board thickness | 0.3–6 mm |
| Material supply | Tape, stick and tray configurations |
