en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Chips and IC packages place different demands on alignment, pickup and mounting force. The Assembléon AX501 addresses these requirements through configurable placement robots and laser- or camera-based component alignment.
Laser alignment provides 40 μm placement accuracy. Camera alignment is specified at 35 μm with the Standard Placement Robot and 25 μm with the Twin Placement Robot, under the manufacturer’s stated conditions.
Controlled placement and flexible material supply
Placement force is programmable from 1.5 to 8 N. Automatic compensation addresses component-thickness and board-height variation, including warpage.
Exchangeable feeder trolleys support product changeover. Available supply formats include tape, sticks and JEDEC tray stackers. The optional TPR configuration adds IC-placement capacity and tray-handling capability.
The AX501 accommodates components from 01005 chips to 45 × 45 mm packages, with standard PCB handling up to 515 × 390 mm.
Key Equipment Specifications
| 목 | 사양 |
|---|---|
| 모델 | Assembléon AX501 / AX-501 |
| Alignment systems | Laser and camera, configuration-dependent |
| Laser placement accuracy | 40 μm |
| Camera accuracy with SPR | 35 μm |
| Camera accuracy with TPR | 25 μm |
| Programmable placement force | 1.5–8 N |
| 구성 요소 범위 | 0.4 × 0.2 to 45 × 45 mm |
| Standard maximum PCB | 515 × 390 mm |
| Standard board thickness | 0.3–6 mm |
| Material supply | Tape, stick and tray configurations |
