gutoranya kwisi no gushyira imashini Fuzion

Ibisobanuro kubikoresho byose bya Fuzion Chip Bonder nibi bikurikira:

Gushyira neza hamwe n'umuvuduko:

Gushyira neza neza: Ntarengwa ntarengwa ni mic 10 microne hamwe na <3 microns isubirwamo.

Umuvuduko wo Gushyira: Kugera kuri 30K cph (30.000 wafers kumasaha) kubisabwa hejuru yubushakashatsi hamwe na 10K cph (10,000 wafers kumasaha) kugirango bipakire neza.

Ubushobozi bwo Gutunganya no Gushyira mu bikorwa:

Ubwoko bwa Chip: Bishyigikira intera nini ya chip, flip chip, hamwe nurwego rwuzuye rwa wafer kugeza kuri 300mm.

Ubwoko bwa Substrate: Irashobora gushyirwa kuri substrate iyariyo yose harimo firime, flex, nimbaho ​​nini.

Ubwoko bwabatanga: Ubwoko butandukanye bwibiryo burahari harimo ibiryo byihuta byihuta.

Ibiranga tekinike n'imikorere:

Umutwe wo hejuru wa Servo watoranijwe Gutoragura imitwe: 14 byuzuye neza (sub-micron X, Y, Z) servo itwara imitwe.

Guhuza Icyerekezo: 100% mbere yo gutoranya icyerekezo no gupfa guhuza.

Intambwe imwe Guhindura: Intambwe imwe ya wafer kugirango apfe guhinduranya.

Gutunganya Byihuta cyane: Ikibanza cya wafer ebyiri, kugeza kuri 16K wafer mu isaha (flip chip) na 14.400 wafers kumasaha (chip-flip).

Ingano nini yo gutunganya: Ingano ntarengwa yo gutunganya substrate ni 635mm x 610mm, naho ubunini bwa wafer ni 300mm (santimetero 12).

Guhinduranya: Gushyigikira ubwoko bugera kuri 52 bwa chip, guhinduranya ibikoresho byikora (nozzle na ejector), ubunini buri hagati ya 0.1mm x 0.1mm kugeza 70mm x 70mm.

Ibi bisobanuro byerekana imikorere isumba iyindi ya chip Fipion ya Universal Fuzion mubijyanye nukuri, umuvuduko nimbaraga zo gutunganya, bikwiranye nubwoko butandukanye bwa chip na substrate, hamwe nubworoherane kandi buhindagurika.

Ibyiza bya Universal Instruments Fuzion ikurikirana ya chip mounters ikubiyemo ibintu bikurikira:

Ubusobanuro bwihuse kandi bwihuse: FuzionSC yamashanyarazi ya semiconductor ifite ubunyangamugayo buhebuje cyane (mic 10 microne) n'umuvuduko (kugeza kuri 10K cph), ishobora gutunganya ibice binini byubutaka mumashanyarazi yihuta cyane yubuso, mugihe ushyira ibice bigize ubwoko ubwo aribwo bwose n'imiterere. Byongeye kandi, ibiryo bya FuzionSC birashobora kugera kuri 16K kumasaha, bikarushaho kunoza umusaruro.

Ubushobozi bunini bwo gutunganya ibikoresho: FuzionSC irashobora gukora ibice byubunini butandukanye, harimo chip kuva 0.1mm x 0.1mm kugeza 70mm x 70mm, ikwiranye nuburyo butandukanye bwo gukoresha. Imashini ishyira FuzionXC ikurikirana ifite sitasiyo zigaburira zigera kuri 272 8mm, zishobora gukora ibicuruzwa bitandukanye icyarimwe, zunganira ibice kuva kuri 01005 kugeza kuri milimetero kare 150 na mm 25 z'uburebure, harimo ibice bikwiranye n’ibinyamakuru, umuhuza, micro BGA, n'ibindi