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universal pick and place machine Fuzion

universal okulonda n'okuteeka ekyuma Fuzion

Sayizi esinga obunene ey’okulongoosa substrate eri mm 635 x mm 610, ate sayizi ya wafer esinga obunene eri mm 300 (yinsi 12) .

Ebisingawo

Ebikwata ku Universal Instruments Fuzion Chip Bonder bye bino wammanga:

Obutuufu bw’okuteeka n’Obwangu:

Obutuufu bw’okuteeka: Obutuufu obusinga obunene buli ±10 microns nga < 3 microns repeatability.

Sipiidi y’okuteeka: Okutuuka ku 30K cph (wafers 30,000 buli ssaawa) ku nkola eziteekebwa ku ngulu ate okutuuka ku 10K cph (wafers 10,000 buli ssaawa) ku kupakinga okw’omulembe.

Obusobozi bw'okukola n'okukozesa:

Chip Type: Ewagira chips ez’enjawulo, flip chips, ne wafer sizes ezijjuvu okutuuka ku 300mm.

Ekika kya Substrate: Kisobola okuteekebwa ku substrate yonna omuli film, flex, n’embaawo ennene.

Ekika ky’Ekigabula: Ebiliisa eby’enjawulo biriwo omuli n’eby’okuliisa wafer eby’amaanyi.

Ebintu eby’ekikugu n’emirimu:

Emitwe gya Pick egyavugibwa Servo egy’obutuufu obw’amaanyi: Emitwe gya pick egyavugibwa servo 14 egy’obutuufu obw’amaanyi (sub-micron X, Y, Z).

Vision Alignment: 100% nga tonnalonda okulaba n’okufa.

Okukyusakyusa okw’omutendera gumu: Okukyusa wafer okutuuka ku kufa okw’omutendera gumu.

Okukola ku sipiidi ey’amaanyi: Omukutu gwa wafer bbiri, wafers eziwera 16K buli ssaawa (flip chip) ne wafers 14,400 buli ssaawa (non-flip chip).

Okulongoosa mu sayizi ennene: Sayizi esinga obunene ey’okulongoosa substrate eri mm 635 x mm 610, ate sayizi ya wafer esinga obunene eri mm 300 (yinsi 12).

Ekola emirimu mingi: Ewagira ebika bya chips ebiwera 52, automatic tool changer (nozzle ne ejector), sayizi eva ku 0.1mm x 0.1mm okutuuka ku 70mm x 70mm.

Ebiwandiiko bino biraga omulimu ogw’oku ntikko ogwa Universal Fuzion chip mounters mu butuufu, sipiidi n’amaanyi g’okukola, ebisaanira ebika bya chip ne substrate eby’enjawulo, nga bikyukakyuka nnyo era nga bikola emirimu mingi

Ebirungi ebiri mu Universal Instruments Fuzion series chip mounters okusinga mulimu bino wammanga:

Obutuufu obw’amaanyi n’obwangu obw’amaanyi: FuzionSC semiconductor mounters zirina obutuufu obw’amaanyi ennyo (±10 microns) n’obwangu (okutuuka ku 10K cph), ezisobola okukola ku substrates ez’ekitundu ekinene mu layini z’okufulumya eziteekebwa ku ngulu ez’amaanyi ennyo, ate nga ziteeka ebitundu eby’ekika kyonna n’enkula. Okugatta ku ekyo, feeder ya FuzionSC esobola okutuuka ku bitundu 16K buli ssaawa, ekyongera okutumbula obulungi bw’okufulumya.

Obusobozi obw’amaanyi obw’okukwata ebitundu: FuzionSC esobola okukwata ebitundu eby’obunene obw’enjawulo, omuli chips okuva ku 0.1mm x 0.1mm okutuuka ku 70mm x 70mm, ezisaanira embeera ez’enjawulo ez’okukozesa. Ekyuma kya FuzionXC series placement machine kirina feeder stations eziwera 272 eza mm 8, ezisobola okukwata ebintu eby’enjawulo mu kiseera kye kimu, nga ziwagira ebitundu okuva ku square millimeters 01005 okutuuka ku square millimeters 150 ne mm 25 obuwanvu, omuli ebitundu ebi press-fit, connectors, micro BGA, . nebirala bingi.

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