universal pick and place machine Fuzion

Tilmaamaha Qalabka Caalamiga ah ee Fuzion Chip Bonder waa sida soo socota:

Xaqiijinta Meelaynta iyo Xawaaraha:

Xaqiijinta Meelaynta: Saxnimada ugu badan waa ± 10 microns oo leh <3 microns ku celin.

Xawaaraha Meelaynta: Ilaa 30K cph (30,000 wafers saacaddii) ee codsiyada korka korka ah iyo ilaa 10K cph (10,000 wafers saacaddii) ee baakadaha horumarsan.

Habaynta Awoodaha iyo Codsiyada:

Nooca Chip: Waxay taageertaa jajabyo kala duwan, jajabyo, iyo cabbir buuxa oo wafer ah ilaa 300mm.

Nooca Substrate: Waxaa lagu dhejin karaa substrate kasta oo ay ku jiraan filim, dabacsanaan, iyo looxyo waaweyn.

Nooca Quudinta: Noocyo kala duwan oo quudiyayaal ah ayaa la heli karaa oo ay ku jiraan feederiyeyaasha xawaaraha sare leh.

Tilmaamaha Farsamada iyo Hawlaha:

Madaxyada Xulashada ee Saxda Sare ee Servo: 14 sax ah oo sarreeya (mikroroon-hoosaadka X, Y, Z) ee servo-ka ah

Iswaafajinta Aragga: 100% horay u soo qaado aragga iyo toosinta dhinta.

Hal-tallaabo Bedelid: Hal-tallaabo wafer si loo dhinto beddelashada.

Hagaajinta Xawaaraha Sare: Madal wafer laba-gees ah, ilaa 16K wafers saacaddii ( chip flip) iyo 14,400 wafers saacaddii ( chip-ka aan leexleexin).

Hagaajinta Cabbirka Weyn: Cabbirka farsamaynta substrate-ka ugu badan waa 635mm x 610mm, iyo cabbirka wafer-ka ugu badan waa 300mm (12 inji).

Kala duwanaansho: Waxay taageertaa ilaa 52 nooc oo chips ah, qalab beddela toos ah (nozzle and ejector), cabbirkoodu wuxuu u dhexeeyaa 0.1mm x 0.1mm ilaa 70mm x 70mm.

Tilmaamahani waxay ka tarjumayaan waxqabadka sare ee Universal Fuzion chip mounters marka loo eego saxsanaanta, xawaaraha iyo awoodda farsamaynta, oo ku habboon noocyo kala duwan oo jajab ah iyo noocyada substrate, oo leh dabacsanaan sare iyo isugeyn.

Faa'iidooyinka Universal Instruments Fuzion jaranjarooyinka jaranjarooyinka inta badan waxaa ka mid ah dhinacyada soo socda:

Saxnaanta sare iyo xawaaraha sare: FuzionSC semiconductor mounters waxay leeyihiin saxsanaan aad u sarreeya (± 10 microns) iyo xawaare (illaa 10K cph), oo awood u leh inay ka baaraandegaan substrate-ka ballaaran ee xariiqyada wax soo saarka dusha sare ee xawaaraha sare leh, halka ay ku dhejinayaan qaybaha nooc kasta iyo qaabka. Intaa waxaa dheer, quudiyaha FuzionSC wuxuu gaari karaa 16K xabbadood saacaddii, taasoo sii horumarinaysa waxtarka wax soo saarka.

Awoodaha wax ka qabashada qaybaha ballaaran: FuzionSC waxay xamili kartaa qaybo cabbirro kala duwan leh, oo ay ku jiraan chips min 0.1mm x 0.1mm ilaa 70mm x 70mm, oo ku habboon xaalado kala duwan oo codsi ah. Mashiinka meelaynta taxanaha FuzionXC wuxuu leeyahay ilaa 272 8mm saldhigyada quudiyaha, kaas oo xamili kara noocyo kala duwan oo badeecado ah isla mar ahaantaana, qaybaha taageeraya ee u dhexeeya 01005 ilaa 150 milimitir laba jibaaran iyo 25 mm sare, oo ay ku jiraan qaybo ku habboon saxaafadda, isku xidhayaasha, micro BGA, iwm.