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MIRTEC MS-11e 3D SPI Solder Paste Inspection System

MIRTEC MS-11e 3D SPI Solder Paste Inspection System

Assess a MIRTEC MS-11e against your solder paste process. Request camera and lens details, software information and a sample-board inspection review.

Gusaba Byihuse Email:smt-sales9@gdxinling.cn
Ibisobanuro

The MIRTEC MS-11e measures solder paste deposits after printing, with dual-projection Moiré phase-shift imaging addressing shadowing during 3D measurement. MIRTEC’s published MS-11e configuration includes a 15-megapixel CoaXPress vision system. 

Its inspection scope includes insufficient and excessive paste, deposit displacement, bridging and shape defects. These results give the printing process more detail than a simple board-level pass or fail.

The value of an MS-11e also depends on how inspection data is reviewed. Pad-level results, repeatability and false-call behaviour deserve attention during a sample-board evaluation, especially where small deposits leave a narrow process window.

When enquiring with us, include the smallest pad dimensions and the required inspection cycle. The camera, lens, software version and available communication functions should be listed for the offered unit.

‌Mirtec 3D SPI MS-11e

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Aderesi ya:No 18, Umuhanda w'inganda Shangliao, Umujyi wa Shajing, Akarere ka Baoan, Shenzhen, Ubushinwa

Inomero ya terefone:+86 13823218491

Imeri:smt-sales9@gdxinling.cn

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