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The MIRTEC MS-11e measures solder paste deposits after printing, with dual-projection Moiré phase-shift imaging addressing shadowing during 3D measurement. MIRTEC’s published MS-11e configuration includes a 15-megapixel CoaXPress vision system.
Its inspection scope includes insufficient and excessive paste, deposit displacement, bridging and shape defects. These results give the printing process more detail than a simple board-level pass or fail.
The value of an MS-11e also depends on how inspection data is reviewed. Pad-level results, repeatability and false-call behaviour deserve attention during a sample-board evaluation, especially where small deposits leave a narrow process window.
When enquiring with us, include the smallest pad dimensions and the required inspection cycle. The camera, lens, software version and available communication functions should be listed for the offered unit.
