sony sl-f130 smt placement machine

The principle of Sony SI-F130 SMT machine mainly includes the following key parts‌:

‌Suction: The SMT head sucks Cassette or BULK components onto the nozzle through vacuum suction.

‌Correction: The parts camera on the SMT head identifies the center offset and deflection of the components on the nozzle, and corrects them through the XY axis and RN axis.

‌Blowing: Under the action of the electromagnetic joystick, the components on the nozzle are blown onto the PCB board.

In addition, the SMT head also has the functions of identifying the positioning holes of the newly installed PCB board, distinguishing the components to be mounted and the components that have been mounted on the PCB. The SMT head consists of five major parts: mechanical parts, electronic parts, software functions, image parts and pneumatic parts, to ensure high-precision SMT operations on the PCB board. ‌Sony SI-F130 is an electronic component SMT machine, mainly used in the electronics manufacturing industry to achieve efficient and accurate placement of electronic components. ‌

Functions and Features‌High-precision placement‌: SI-F130 is equipped with high-precision large substrates, and supports a maximum LED substrate size of 710mm×360mm, suitable for substrates of various sizes‌. ‌Efficient production‌: The equipment can mount 25,900 components per hour under specified conditions, suitable for large-scale production needs‌. ‌Versatility‌: Supports a variety of component sizes, including 0402-□12mm (mobile camera) and □6mm-□25mm (fixed camera) with a height of less than 6mm‌. ‌Smart experience‌: Although SI-F130 itself does not include AI functions, its design focuses on rapid implementation and traceability, suitable for environments that require efficient production‌. ‌Technical parameters

‌Installation speed‌: 25,900 CPH (company-specified conditions)‌

‌Target component size‌: 0402-□12mm (mobile camera), □6mm-□25mm (fixed camera), height within 6mm‌

‌Target board size‌: 150mm×60mm-710mm×360mm‌

‌Head configuration‌: 1 head/12 nozzles‌

‌Power supply requirements‌: AC3 phase 200V±10% 50/60Hz 1.6kVA‌

‌Air consumption‌: 0.49MPa 0.5L/min (A.N.R) ‌

‌Size‌: W1,220mm×D1,400mm×H1,545mm (excluding signal tower) ‌

‌Weight‌: 1,560kg ‌

Application scenarios

Sony SI-F130 is suitable for production environments that require efficient and precise installation of electronic components, especially for large-scale production and scenarios that require high-precision installation