SAKI 3D SPI machine 3Si LS2

SAKI 3D SPI 3Si LS2 is a 3D solder paste inspection system, mainly used to inspect the quality of solder paste printing on printed circuit boards (PCBs). ‌

Main features and application scenarios

SAKI 3Si LS2 has the following main features:

‌High precision‌: Supports three resolutions of 7μm, 12μm, and 18μm, suitable for high-precision solder paste inspection needs.

‌Large format support‌: Supports circuit board sizes up to 19.7 x 20.07 inches (500 x 510 mm), suitable for a variety of application scenarios.

‌Z-axis solution‌: Innovative Z-axis optical head control function can detect high components, crimped components and PCBAs in fixtures, ensuring accurate inspection of high components.

‌3D inspection‌: Supports 2D and 3D modes, with a maximum height measurement range of up to 40 mm, suitable for complex surface mount components.

Technical specifications and performance parameters

The technical specifications and performance parameters of SAKI 3Si LS2 include:

‌Resolution‌: 7μm, 12μm and 18μm

‌PCB size‌: Maximum 19.7 x 20.07 inches (500 x 510 mm)

‌Maximum height measurement range‌: 40 mm

‌Detection speed‌: 5700 square millimeters/second

Market positioning and user evaluation

SAKI 3Si LS2 is positioned in the market as a high-precision 3D solder paste inspection system for industrial applications that require high-precision inspection. User evaluations show that the system performs well in terms of inspection accuracy and efficiency, which can significantly improve production efficiency and product quality.

‌SAKI 3Si LS2's advantages in the field of 3D solder paste inspection (SPI) are mainly reflected in the following aspects‌:

‌High accuracy and repeatability‌: SAKI 3Si LS2 uses advanced 3D measurement technology, combined with 2D images and 3D height confirmation, to achieve extremely accurate inspection. Its hardware configuration includes a closed-loop, dual servo motor drive system, a high-resolution linear scale, and a rigid gantry structure to ensure measurement accuracy and repeatability.

‌Large-format inspection capability‌: The device supports large-format inspection, with a maximum circuit board size of up to 19.7 x 20.07 inches (500 x 510 mm), and provides three resolutions of 7μm, 12μm, and 18μm, suitable for a variety of application scenarios.

‌Efficient production line integration‌: SAKI 3Si LS2 has an M2M solution, which can perfectly realize the closed-loop control function of the production line equipment, feed back the inspection results to the front-end printer and the back-end placement machine, and intelligently correct the solder paste printing and component placement, thereby improving the production efficiency and quality of the entire assembly line.