ASM Die Bonding machine AD800

I-ASM die bonding machine AD800 yi-high-performance, umatshini wokuzibophelela ngokugqibeleleyo wokufa onemisebenzi emininzi ephezulu kunye neempawu. Oku kulandelayo yintshayelelo yayo eneenkcukacha:

Iimpawu eziphambili

Ukusebenza kwe-Ultra-high-speed: Ixesha lomjikelezo we-AD800 die bonding machine yi-50 milliseconds, ephucula kakhulu ukusebenza kwemveliso.

Ukubekwa kwe-high-precision positioning: Ukuchaneka kwesikhundla se-XY yi-± 25 microns, kunye nokuchaneka kokujikeleza kwe-mold yi-± 3 degrees, iqinisekisa ukuchaneka okuphezulu kokusebenza kwe-die bonding.

Uluhlu olubanzi lweSicelo: Iyakwazi ukuphatha iimbumba ezincinci (eziphantsi kwe-3 mil) kunye ne-substrates enkulu (ukuya kwi-270 x 100 mm), ifanelekile kwiimeko ezahlukeneyo zesicelo.

Ukuhlolwa komgangatho obanzi: Uxhotyiswe ngokuhlolwa kwesiphene, imisebenzi yokuhlola umgangatho obanzi ngaphambi nasemva kokudibanisa ukuqinisekisa umgangatho wemveliso.

Imisebenzi ezenzekelayo: Ukutsiba ngokuzenzekelayo iiyunithi kunye nokubumba, i-inking okanye imisebenzi ekumgangatho ophantsi, kunye nemisebenzi yokuhlola ngaphambi nangemva kokubambisana, ukuphucula ngakumbi ukusebenza kakuhle kwemveliso kunye nomgangatho wemveliso.

Uyilo olugcina umbane: Ukusebenzisa uyilo lwemoto oluyilayini, lunciphisa iindleko zolondolozo kwaye luneempawu zokonga umbane kunye nokusetyenziswa kwamandla aphantsi.

Ukusebenza kwemveliso ephezulu: I-UPH ephezulu (imveliso ngeyure) kunye nomlinganiselo wokuhlala uphucula ukusetyenziswa kwendawo yefektri.

Iiparamitha zobugcisa

Imilinganiselo: Ububanzi, ubunzulu kunye nobude 1570 x 1160 x 2057 mm.

Iimeko zesicelo

I-AD800 die bonding machine ilungele iimeko ezahlukeneyo zesicelo sezixhobo zokupakisha i-chip, ngakumbi kwintsimi yokupakishwa kwe-semiconductor. Inokusingatha iintlobo ezininzi ze-substrates kunye nokubumba ukuhlangabezana neemfuno ezahlukeneyo zemveliso