Ukukhangela ngokukhawuleza
ucingo bonder FAQ
MAXUM PLUS Kuninzi lwezicelo, imveliso (UPH) yonyuka nge-10% kwisizukulwana sangaphambili
Isantya sokubopha ucingo sifikelela kwi-1.8K (iingcingo ezine kunye neebhola ezine zegolide), iphucula kakhulu ukusebenza kakuhle kwemveliso.
Inokudibana neentlobo ezahlukeneyo zokupakishwa kwe-LED, kubandakanya iimveliso eziqhelekileyo ezifana ne-3528 kunye ne-5050.
Inzwa ibona indawo kunye ne-angle ye-chip okanye i-substrate kwaye idlulisela idatha kwi-generator laser.
Uyilo lwebhentshi yokusebenzela yenza i-welding ikhawuleze, ichaneke ngakumbi kwaye izinzile.
I-ASMPT AERO CAM series wire bonder yenzelwe ngokukodwa ukupakishwa kwemodyuli yekhamera
I-AB589 ye-wire bonder sisixhobo sokubopha ucingo oluphezulu oluveliswe yi-ASMPT
Ukuchaneka kwe-wire bonder yale ntambo yocingo ifikelela kwi-± 2 microns
I-wire bonder yenza kakuhle ekusebenzeni kwexesha elide kwaye inozinzo oluphezulu, olunokuqinisekisa ukuqhubeka nokuthembeka kwenkqubo yokuvelisa.
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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