i-asm wire Bonding machine Eagle Aero Reel ukuya kwiReel

I-ASM wire bonder I-Eagle Aero Reel ukuya kwi-Reel sisixhobo sokubopha ucingo oluphezulu olulungiselelwe ukupakishwa kwe-semiconductor kunye nemveliso yokuvavanya. Oku kulandelayo yintshayelelo eneenkcukacha:

Iimbonakalo

Ukuchaneka okuphezulu: I-Eagle Aero wire bonder ithatha itekhnoloji ephezulu yokubeka i-optical positioning kunye ne-high-precision motion control system ukuze kuphunyezwe inkqubo yokudibanisa ucingo oluchanekileyo.

I-Multi-function: Ifanelekile kwiindidi zeepakethe ezahlukeneyo, ezibandakanya i-QFN, i-DFN, i-TQFP, i-LQFP yokupakisha, kunye ne-module ye-optical COC, i-COB yokupakisha.

Ukusebenza okuphezulu: Ngokuhamba ngesantya esiphezulu kunye nemisebenzi yokutshintsha ucingo ngokukhawuleza, kunokuphucula kakhulu ukusebenza kwemveliso.

Kulula ukusebenza: Ngojongano lokusebenza olusebenziseka lula kunye nenkqubo yolawulo ekrelekrele, kulula ukuyisebenzisa nokufunda.

Imeko yesicelo

I-Eagle Aero wire bonder isetyenziselwa ikakhulu inkqubo yokubopha ucingo kwi-semiconductor yokupakisha kunye nokuveliswa kovavanyo. Umgangatho wokudibanisa ucingo uchaphazela ngokuthe ngqo ukuthembeka kunye nokusebenza kweemveliso ezipakishweyo. Ngoko ke, i-Eagle Aero wire bonder inokuhlangabezana neemfuno zokudibanisa ucingo lweentlobo ezahlukeneyo zepakethe kwaye ibonelele ngokufanelekileyo kunye nenkqubo echanekileyo yokudibanisa intambo yokupakishwa kwe-semiconductor kunye nokuveliswa kovavanyo.

Umgaqo wokusebenza we-ASM wire bonder ikakhulu ubandakanya la manyathelo alandelayo:

Ukubamba i-chip okanye i-substrate : Okokuqala, ingalo yerobhothi ibamba itshiphu okanye i-substrate kwaye iyise kwindawo echaziweyo.

Ukulungelelanisa izikhokelo : Inkqubo yokuqhuba ilawula intshukumo yengalo yerobhothi ukuze izikhokelo zetshiphu okanye isubstrate zihambelane nelensi.

Isikhundla kunye nokufumanisa i-angle : Inzwa ibona indawo kunye ne-angle ye-chip okanye i-substrate kwaye idlulisele idatha kwi-laser generator.

Ukuwelda kweLaser: Ijenereyitha yelaser ivelisa i-laser ukuwelda iintambo phakathi kwetshiphu kunye nesubstrate.