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The ETC RSV152M-613-LE introduces vacuum processing into an inline convection reflow sequence. Six heating zones bring the assembly to the required soldering condition, followed by a dedicated vacuum stage and three cooling zones.
Reducing pressure while the solder is molten helps trapped gases escape from the joint. This makes vacuum reflow relevant to assemblies with large soldered interfaces, where voiding can affect heat transfer and joint integrity. The final void level depends on the solder paste, joint geometry and process recipe.
The RSV platform combines nitrogen circulation heating with vacuum treatment and includes flux collection. We supply the RSV152M-613-LE against the required board format and thermal process, with the installed utilities and configuration identified in the quotation.
ETC RSV152M-613-LE Core Technical Specifications
| Parameeter | Spetsifikatsioon |
|---|---|
| Mudel | RSV152M-613-LE |
| Manufacturer | Eightech Tectron — ETC |
| Küttetsoonid | 6 |
| Vacuum Zones | 1 |
| Jahutustsoonid | 3 |
| Published Vacuum Pressure Range | 1–12 kPa |
| Toiteallikas | Three-phase 200 V |
| PCB Size, L × W | 100 × 100 to 330 × 250 mm |
| Standard Component Clearance | 30 mm above and below the PCB |
| Overall Dimensions, L × W × H | 6,701 × 1,350 × 1,500 mm |
| Flux Collection | Standardne |
Specifications correspond to the referenced RSV152M-613-LE configuration. Confirm the individual machine’s electrical and process specifications before installation.
