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ETC RSV152M-613-LE Vacuum Reflow Oven

ETC RSV152M-613-LE Vacuum Reflow Oven

ETC RSV152M-613-LE combines six heating zones, vacuum processing and three cooling zones for low-void soldering. Contact us for equipment details and pricing.

Gusaba Byihuse Email:smt-sales9@gdxinling.cn
Ibisobanuro

The ETC RSV152M-613-LE introduces vacuum processing into an inline convection reflow sequence. Six heating zones bring the assembly to the required soldering condition, followed by a dedicated vacuum stage and three cooling zones.

Reducing pressure while the solder is molten helps trapped gases escape from the joint. This makes vacuum reflow relevant to assemblies with large soldered interfaces, where voiding can affect heat transfer and joint integrity. The final void level depends on the solder paste, joint geometry and process recipe.

The RSV platform combines nitrogen circulation heating with vacuum treatment and includes flux collection. We supply the RSV152M-613-LE against the required board format and thermal process, with the installed utilities and configuration identified in the quotation.

ETC RSV152M-613-LE Core Technical Specifications

ParameterIbisobanuro
IcyitegererezoRSV152M-613-LE
ManufacturerEightech Tectron — ETC
Ahantu hashyuha6
Vacuum Zones1
Ahantu hakonje3
Published Vacuum Pressure Range1–12 kPa
AmashanyaraziThree-phase 200 V
PCB Size, L × W100 × 100 to 330 × 250 mm
Standard Component Clearance30 mm above and below the PCB
Overall Dimensions, L × W × H6,701 × 1,350 × 1,500 mm
Flux CollectionBisanzwe

Specifications correspond to the referenced RSV152M-613-LE configuration. Confirm the individual machine’s electrical and process specifications before installation.

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Inomero ya terefone:+86 13823218491

Imeri:smt-sales9@gdxinling.cn

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