en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The ETC RSV152M-613-LE introduces vacuum processing into an inline convection reflow sequence. Six heating zones bring the assembly to the required soldering condition, followed by a dedicated vacuum stage and three cooling zones.
Reducing pressure while the solder is molten helps trapped gases escape from the joint. This makes vacuum reflow relevant to assemblies with large soldered interfaces, where voiding can affect heat transfer and joint integrity. The final void level depends on the solder paste, joint geometry and process recipe.
The RSV platform combines nitrogen circulation heating with vacuum treatment and includes flux collection. We supply the RSV152M-613-LE against the required board format and thermal process, with the installed utilities and configuration identified in the quotation.
ETC RSV152M-613-LE Core Technical Specifications
| ພາລາມິເຕີ | ຂໍ້ມູນຈໍາເພາະ |
|---|---|
| ຕົວແບບ | RSV152M-613-LE |
| Manufacturer | Eightech Tectron — ETC |
| ເຂດຄວາມຮ້ອນ | 6 |
| Vacuum Zones | 1 |
| ເຂດເຮັດຄວາມເຢັນ | 3 |
| Published Vacuum Pressure Range | 1–12 kPa |
| ການສະຫນອງພະລັງງານ | Three-phase 200 V |
| PCB Size, L × W | 100 × 100 to 330 × 250 mm |
| Standard Component Clearance | 30 mm above and below the PCB |
| Overall Dimensions, L × W × H | 6,701 × 1,350 × 1,500 mm |
| Flux Collection | ມາດຕະຖານ |
Specifications correspond to the referenced RSV152M-613-LE configuration. Confirm the individual machine’s electrical and process specifications before installation.
