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EWAKA>ekyamaguzi > ekyuma kya smt > Reflow Oven >
ETC RSV152M-613-LE Vacuum Reflow Oven

ETC RSV152M-613-LE Vacuum Reflow Oven

ETC RSV152M-613-LE combines six heating zones, vacuum processing and three cooling zones for low-void soldering. Contact us for equipment details and pricing.

Okusaba okw'amangu Email:smt-sales9@gdxinling.cn
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The ETC RSV152M-613-LE introduces vacuum processing into an inline convection reflow sequence. Six heating zones bring the assembly to the required soldering condition, followed by a dedicated vacuum stage and three cooling zones.

Reducing pressure while the solder is molten helps trapped gases escape from the joint. This makes vacuum reflow relevant to assemblies with large soldered interfaces, where voiding can affect heat transfer and joint integrity. The final void level depends on the solder paste, joint geometry and process recipe.

The RSV platform combines nitrogen circulation heating with vacuum treatment and includes flux collection. We supply the RSV152M-613-LE against the required board format and thermal process, with the installed utilities and configuration identified in the quotation.

ETC RSV152M-613-LE Core Technical Specifications

ParameterOkunnyonnyola
EkifaananyiRSV152M-613-LE
ManufacturerEightech Tectron — ETC
Zooni z’ebbugumu6
Vacuum Zones1
Zooni z’okunyogoza3
Published Vacuum Pressure Range1–12 kPa
AmasannyalazeThree-phase 200 V
PCB Size, L × W100 × 100 to 330 × 250 mm
Standard Component Clearance30 mm above and below the PCB
Overall Dimensions, L × W × H6,701 × 1,350 × 1,500 mm
Flux CollectionOmutindo

Specifications correspond to the referenced RSV152M-613-LE configuration. Confirm the individual machine’s electrical and process specifications before installation.

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Email:smt-okutunda9@gdxinling.cn

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