SAKI 3Si-LS3EX Large-Format 3D SPI Machine

The SAKI 3Si-LS3EX handles PCB formats up to 510 × 510 mm in its documented single-lane configuration. For dual-lane operation, the published board range is reduced to 50 × 60 mm through 320 × 510 mm. This makes the selected lane arrangement an important factor when matching the machine to the board mix in a production line.

The LS3EX measures solder-paste area, height and volume. Its inspection functions also include checks for bridging, solder-paste horns and BGA coplanarity. These measurements help distinguish different types of print variation and provide quantitative information for process review before components are mounted.

SAKI lists 8 μm and 15 μm optical resolution options for this model. The main body measures approximately 1,040 × 1,480 × 1,500 mm, and the published weight is about 900 kg. Standard PCB clearance is 40 mm above and 60 mm below the board; dual-lane operation changes the lower clearance to 50 mm.

The system can be connected to other SMT equipment when compatible interfaces and software are available. For installations requiring printer feedback or process data exchange, confirm the communication options on the actual unit rather than assuming every interface is included as standard.

SAKI 3Si-LS3EX 3D SPI System Specifications

Configuration note: Verify the installed optical head, lane mode, utilities and communication interfaces for the supplied machine before finalizing its listing.