‌ASM Die Bonding machine AD50Pro

The working principle of ASM die bonder AD50Pro mainly includes heating, rolling, control system and auxiliary equipment. Specifically:

‌Heating‌: The die bonder first raises the temperature of the working area to the required curing temperature by electric heating or other means. The heating system usually consists of a heater, a temperature sensor and a controller to ensure correct temperature control.

‌Rolling‌: Some die bonders are equipped with a rolling system to compress the material during the curing process. This helps to improve the die bonding effect, eliminate bubbles and improve the adhesion of the material.

‌Control system‌: The die bonder usually has an automatic control system to achieve precise die bonding by controlling parameters such as temperature and rolling. This helps to ensure the stability and consistency of the production process.

‌Auxiliary equipment‌: The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices, to accelerate the cooling of materials during the curing process and improve production efficiency.

In addition, the following points should be noted during the specific operation and maintenance of the die bonder:

‌Mechanical structure and maintenance‌: Including the maintenance and adjustment of components such as chip controllers, ejectors, and fixtures. For example, the ejector is mainly composed of ejector pins, ejector motors, etc., and damaged components need to be checked and replaced regularly.

Parameter setting: Before operation, the PR system of the operating material needs to be adjusted and the program needs to be set. Improper parameter setting may cause defects, such as wafer picking parameters, table crystal placement parameters, ejector parameters, etc. need to be adjusted to the appropriate position.

Image recognition processing system: The die bonder is also equipped with a PRS (image recognition processing system) that can accurately identify and process the operating materials.