en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The LS-size configuration of the SAKI 3Di-LS3EX accommodates PCBs up to 510 × 510 mm in single-lane mode. For dual-lane operation, the published board range changes to 50 × 60 mm through 320 × 510 mm. This distinction matters when evaluating large boards or planning a conveyor layout around the inspection station.
The EX-series optical system is available in 8 μm and 15 μm resolutions. SAKI has also presented the 3Di-LS3EX with a 15 μm optical system, Z-axis solution and side-camera system. These options extend the available inspection views and can be relevant when boards contain tall components or features that are difficult to assess from an overhead view alone.
The machine’s main body measures approximately 1,040 × 1,480 × 1,500 mm and weighs about 900 kg. Standard clearance is listed as 40 mm above and 60 mm below the PCB; in dual-lane mode, the specified lower clearance changes to 50 mm. Monitor arrangements include arm-mounted and built-in styles, depending on configuration.
تحديد
| غرض | مواصفة |
|---|---|
| ماركة | SAKI |
| نموذج | 3Di-LS3EX |
| Inspection Method | 3D optical inspection |
| Optical Resolution | 8 μm / 15 μm |
| PCB Size, Single Lane | 50 × 60 to 510 × 510 mm |
| PCB Size, Dual Lane | 50 × 60 to 320 × 510 mm |
| Main-Body Dimensions | Approx. 1,040 × 1,480 × 1,500 mm |
| وزن | حوالي 900 كجم |
| PCB Clearance | Top 40 mm; bottom 60 mm standard / 50 mm dual lane |
| مزود الطاقة | Single-phase 200–240 V ±10%, 50/60 Hz |
Confirm the installed optical head, side camera, Z-axis option, monitor style and conveyor mode for the machine being offered.
