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The LS-size configuration of the SAKI 3Di-LS3EX accommodates PCBs up to 510 × 510 mm in single-lane mode. For dual-lane operation, the published board range changes to 50 × 60 mm through 320 × 510 mm. This distinction matters when evaluating large boards or planning a conveyor layout around the inspection station.
The EX-series optical system is available in 8 μm and 15 μm resolutions. SAKI has also presented the 3Di-LS3EX with a 15 μm optical system, Z-axis solution and side-camera system. These options extend the available inspection views and can be relevant when boards contain tall components or features that are difficult to assess from an overhead view alone.
The machine’s main body measures approximately 1,040 × 1,480 × 1,500 mm and weighs about 900 kg. Standard clearance is listed as 40 mm above and 60 mm below the PCB; in dual-lane mode, the specified lower clearance changes to 50 mm. Monitor arrangements include arm-mounted and built-in styles, depending on configuration.
Especificaciones rehegua
| Artículo | Especificación rehegua |
|---|---|
| Téra | SAKI |
| Techapyrãramo | 3Di-LS3EX |
| Inspection Method | 3D optical inspection |
| Optical Resolution | 8 μm / 15 μm |
| PCB Size, Single Lane | 50 × 60 to 510 × 510 mm |
| PCB Size, Dual Lane | 50 × 60 to 320 × 510 mm |
| Main-Body Dimensions | Approx. 1,040 × 1,480 × 1,500 mm |
| Pohýi | Aprox. 900 kg |
| PCB Clearance | Top 40 mm; bottom 60 mm standard / 50 mm dual lane |
| Fuente de Alimentación rehegua | Single-phase 200–240 V ±10%, 50/60 Hz |
Confirm the installed optical head, side camera, Z-axis option, monitor style and conveyor mode for the machine being offered.
