en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Reflective component surfaces and solder joints place different demands on an inspection system. The MIRTEC MV-6e combines telecentric camera optics with multi-phase colour lighting, providing different illumination conditions for evaluating assembled boards.
Top-down inspection covers component presence, alignment, polarity and visible solder conditions. Depending on configuration, side-view cameras add angled images, while INTELLI-SCAN laser inspection provides height and coplanarity checks for specified devices.
The MV-6e’s laser-based capability differs from the Moiré-based inspection of the MV-6e OMNI. We identify the installed camera, lighting and measurement hardware in the equipment specification, so the inspection scope is clear before purchase.
MIRTEC MV-6e Core Technical Specifications
| Պարամետր | Հստակեցում |
|---|---|
| Մոդել | MV-6e |
| Equipment Type | Inline AOI with configuration-dependent laser 3D inspection |
| Standard PCB Inspection Area | 50 × 50 to 510 × 460 mm |
| Top-Down Camera Options | 10 MP Camera Link / 18 MP CoaXPress |
| Pixel Resolution — 10 MP | 13.4 or 9.8 μm per pixel |
| Pixel Resolution — 18 MP | 9.8 or 7.3 μm per pixel |
| Side-View Camera Options | Four 10 MP or 18 MP cameras |
| Height Inspection System | INTELLI-SCAN laser, where installed |
| Lighting System | Eight-phase colour LED |
| Lens Type | Precision telecentric compound lens |
